Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using Thermocompression Bonding

Yu Tao Yang, Chaowei Hu, Jazmine Green, Peng Zhang, Niloofar Shakoorzadeh, Pranav Ambhore, Umesha Mogera, Ni Ni, Kang L. Wang, Subramanian S. Iyer

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, the silicon interconnect fabric (Si-IF) technology is extended to superconducting electronics using niobium (Nb) as the superconducting interconnect (Superconducting-IF). It has advantages of solderless metal- metal interconnects, fine pitch integration (≤ 10 μm), no complex packaging, an inter-dielet spacing of <100 μm, high bandwidth, low latency, low power generation and low power dissipation. In this platform, superconductor, Nb, is used as the interconnect material and a low-temperature Au-Au thermocompression bonding at 140°C that retains the transition temperature is established. Au-Au bonding was first studied and optimized through shear strength tests using a blanket structure. The average shear force obtained was >100 N over 2×2 mm2 dies. The optimized parameters are: a 3-min Ar plasma surface pre-bonding clean, a bonding temperature of 140°C, at a bonding pressure of 35 MPa for a duration of 1.5 s followed by a post-bond annealing duration of 2 min at 140°C. A Kelvin test structure was fabricated to measure the superconductivity of Nb before and after each process. Under all processing conditions, the transition temperature of Nb remained at 9 K The resistance of Nb interconnects with Au thin-film bonding sites approached zero below the transition temperature of 9 K.

Original languageEnglish
Title of host publicationProceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1861-1866
Number of pages6
ISBN (Electronic)9781728161808
DOIs
Publication statusPublished - 2020 Jun
Event70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
Duration: 2020 Jun 32020 Jun 30

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2020-June
ISSN (Print)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
CountryUnited States
CityOrlando
Period20-06-0320-06-30

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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