Dependence of microstructural evolution of nanoindented Cu/Si thin films on annealing temperature

Woei-Shyan Lee, Tao Hsing Chen, Chi Feng Lin, Yu Liang Chuang

Research output: Contribution to journalArticle

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Abstract

The nano-mechanical properties of as-deposited Cu/Si thin films indented to a depth of 2000 nm are investigated using a nanoindentation technique. The nanoindented specimens are annealed at a temperature of either 160°C or 210°C, respectively. The microstructures of the asdeposited and annealed samples are then examined via transmission electron microscopy (TEM). The results show that both the loading and the unloading regions of the load-displacement curve are smooth and continuous, which suggests that no debonding or cracking occurs during nanoindentation. In addition, the hardness and Young's modulus of the Cu/Si thin films are found to vary with the nanoindentation depth, and have maximum values of 2.8 GPa and 143 GPa, respectively, at the maximum indentation depth of 2000 nm. The TEM observations show that the region of the Cu/Si film beneath the indenter undergoes a phase transformation during the indentation process. In the case of the as-deposited specimens, the indentation pressure induces a completely amorphous phase within the indentation zone. For the specimens annealed at a temperature of 160°C, the amorphous nature of the microstructure within the indented zone is maintained. However, for the specimens annealed at a higher temperature of 210°C, the indentation affected zone consists of a mixture of amorphous phase and nanocrystalline phase. Copper suicide (η-Cu 3 Si) precipitates are observed in all of the annealed specimens. The density of the η-Cu 3 Si precipitates is found to increase with an increasing annealing temperature.

Original languageEnglish
Pages (from-to)2013-2018
Number of pages6
JournalMaterials Transactions
Volume51
Issue number11
DOIs
Publication statusPublished - 2010 Nov 1

Fingerprint

Microstructural evolution
indentation
Indentation
Annealing
Nanoindentation
Thin films
nanoindentation
annealing
thin films
Precipitates
precipitates
Temperature
temperature
Transmission electron microscopy
transmission electron microscopy
microstructure
Microstructure
unloading
Debonding
Unloading

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Lee, Woei-Shyan ; Chen, Tao Hsing ; Lin, Chi Feng ; Chuang, Yu Liang. / Dependence of microstructural evolution of nanoindented Cu/Si thin films on annealing temperature. In: Materials Transactions. 2010 ; Vol. 51, No. 11. pp. 2013-2018.
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Dependence of microstructural evolution of nanoindented Cu/Si thin films on annealing temperature. / Lee, Woei-Shyan; Chen, Tao Hsing; Lin, Chi Feng; Chuang, Yu Liang.

In: Materials Transactions, Vol. 51, No. 11, 01.11.2010, p. 2013-2018.

Research output: Contribution to journalArticle

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