Design and development of compact spiral ribbed cooling unit for electronic chipsets with high power densities

Shyy-Woei Chang, Chiang Kuei Feng, Wang Huiru, Huang Chuan Chin, Kao Juei Ken

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the results of a set of numerical and experimental studies for flow and heat transfer in a spiral channel roughened by skew ribs over two opposite endwalls. The experimental Nusselt number (Nu) distributions, pressure drop coefficients (f) and thermal performance factors (η) for the spiral ribbed channel are examined along with the flow structures determined from the CFD analysis. The comparisons of Heat Transfer Enhancement (HTE) ratios measured from the ribbed spiral channel with other passive types of HTE devices confirm the favorable HTE performances for the spiral channel with the in-line skew ribs. A subsequent design and product development for the liquid cooling unit using the ribbed spiral channel is described with the pressure drops and thermal resistances presented. This study confirms the availability of the enhanced liquid cooling performance using the spiral ribbed channel for the electronic chipset(s) with higher power densities.

Original languageEnglish
Title of host publication27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011
Pages231-238
Number of pages8
DOIs
Publication statusPublished - 2011 Jun 2
Event27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011 - San Jose, CA, United States
Duration: 2011 Mar 202011 Mar 24

Publication series

NameAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
ISSN (Print)1065-2221

Other

Other27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011
CountryUnited States
CitySan Jose, CA
Period11-03-2011-03-24

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Electrical and Electronic Engineering

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  • Cite this

    Chang, S-W., Feng, C. K., Huiru, W., Chin, H. C., & Ken, K. J. (2011). Design and development of compact spiral ribbed cooling unit for electronic chipsets with high power densities. In 27th Annual IEEE Semiconductor Thermal Measurement and Management, SEMI-THERM 27 2011 (pp. 231-238). [5767206] (Annual IEEE Semiconductor Thermal Measurement and Management Symposium). https://doi.org/10.1109/STHERM.2011.5767206