Design and dynamics of an innovative micro gyroscope against coupling effects

Nan-Chyuan Tsai, Chung Yang Sue, Chih Che Lin

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

This paper presents an innovative micro gyroscope design. The proposed tri-axis gyroscope possesses the capability of detecting three-dimensional angular motions. The motion of each sensing element is, by elaborate mechanical design, restricted to move in orthogonal direction to each other such that the measurements by high-resolution capacitors with signal processing circuits are decoupled and precisely represent, to some extent, angular velocity components in three axes. The drive electrode comb is used to constantly vibrate the proof mass in tangential direction by sinusoidal voltage. The signal bandwidth is increased by distributed translational proof masses, placed ninety degree apart from each other. Each individual proof mass is designed to move solely in radial direction so that superior mode matching can be achieved. In order to ensure better repeatability and more reliability, the suspension flexures and damping effects are studied such that stress of the proposed micro gyroscope is reduced but the span of angular displacements is increased. Owing to the complicated geometry of the suspension flexures, finite element method (FEM) is employed to obtain more exact stiffness values and compared with theoretical analysis. The dynamic model of the proposed gyroscope is established to include non-linear terms and embedded mechanical constraints. The entire micro device can be produced merely by surface fabrication such that the mass production cost can be considered at the design stage, while the resolution, bandwidth and decoupling capability of tri-axis detection are enhanced.

Original languageEnglish
Pages (from-to)295-306
Number of pages12
JournalMicrosystem Technologies
Volume14
Issue number3
DOIs
Publication statusPublished - 2008 Mar 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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