Abstract
Recently, high power LED is more and more important due to requirement of illumination. To achieve the greater performance of electric path and heat dissipation ability, the metal core PCB (MCPCB) is used to replace the common FR4 PCB. The MCPCB is composed of copper film, dielectric and metal base. Metal base is made of copper or aluminum and has high thermal conductivity to conduct heat from LED to heat sink. However, the low thermal conductivity of dielectric layer in the middle of MCPCB will cause the temperature raise. In this study, we use 30% diamond powder as the filler of dielectric layer and combined the PCB and flat plate heat pipe (PCB-FPHP) without metal base to enhance the effective thermal conductivity. In order to verify the performance of diamond powder PCB-FPHP, we experimental measured the PCB-FPHP and common MCPCB conducted with 3 different materials include Cu, Al and FPHP by IR camera. The experimental results shows that the thermal resistance of PCB-FPHP is 36%, 78% and 86% lower than MCPCB-FPHP, MCPCB-Cu, and MCPCB-Al respectively. It is obviously that the thermal resistance of metal base and the thermal grease cannot be neglected especially in high power application. The structure of PCB-substrate we propose in this paper can reduce the junction temperature about 0.36°C/W compare with MCPCB-substrate. It is a meaningful number for high power LED application.
| Original language | English |
|---|---|
| Title of host publication | 2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013 |
| Pages | 158-163 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 2013 Nov 25 |
| Event | 2013 10th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013 - Takamastu, Japan Duration: 2013 Aug 4 → 2013 Aug 7 |
Publication series
| Name | 2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013 |
|---|
Other
| Other | 2013 10th IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013 |
|---|---|
| Country | Japan |
| City | Takamastu |
| Period | 13-08-04 → 13-08-07 |
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All Science Journal Classification (ASJC) codes
- Artificial Intelligence
- Electrical and Electronic Engineering
- Mechanical Engineering
Cite this
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Design and estimation of a MCPCB-flat plate heat pipe for LED array module. / Shen, Sheng-Chih; Huang, H. J.; Shaw, Heiu-Jou.
2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013. 2013. p. 158-163 6617910 (2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Design and estimation of a MCPCB-flat plate heat pipe for LED array module
AU - Shen, Sheng-Chih
AU - Huang, H. J.
AU - Shaw, Heiu-Jou
PY - 2013/11/25
Y1 - 2013/11/25
N2 - Recently, high power LED is more and more important due to requirement of illumination. To achieve the greater performance of electric path and heat dissipation ability, the metal core PCB (MCPCB) is used to replace the common FR4 PCB. The MCPCB is composed of copper film, dielectric and metal base. Metal base is made of copper or aluminum and has high thermal conductivity to conduct heat from LED to heat sink. However, the low thermal conductivity of dielectric layer in the middle of MCPCB will cause the temperature raise. In this study, we use 30% diamond powder as the filler of dielectric layer and combined the PCB and flat plate heat pipe (PCB-FPHP) without metal base to enhance the effective thermal conductivity. In order to verify the performance of diamond powder PCB-FPHP, we experimental measured the PCB-FPHP and common MCPCB conducted with 3 different materials include Cu, Al and FPHP by IR camera. The experimental results shows that the thermal resistance of PCB-FPHP is 36%, 78% and 86% lower than MCPCB-FPHP, MCPCB-Cu, and MCPCB-Al respectively. It is obviously that the thermal resistance of metal base and the thermal grease cannot be neglected especially in high power application. The structure of PCB-substrate we propose in this paper can reduce the junction temperature about 0.36°C/W compare with MCPCB-substrate. It is a meaningful number for high power LED application.
AB - Recently, high power LED is more and more important due to requirement of illumination. To achieve the greater performance of electric path and heat dissipation ability, the metal core PCB (MCPCB) is used to replace the common FR4 PCB. The MCPCB is composed of copper film, dielectric and metal base. Metal base is made of copper or aluminum and has high thermal conductivity to conduct heat from LED to heat sink. However, the low thermal conductivity of dielectric layer in the middle of MCPCB will cause the temperature raise. In this study, we use 30% diamond powder as the filler of dielectric layer and combined the PCB and flat plate heat pipe (PCB-FPHP) without metal base to enhance the effective thermal conductivity. In order to verify the performance of diamond powder PCB-FPHP, we experimental measured the PCB-FPHP and common MCPCB conducted with 3 different materials include Cu, Al and FPHP by IR camera. The experimental results shows that the thermal resistance of PCB-FPHP is 36%, 78% and 86% lower than MCPCB-FPHP, MCPCB-Cu, and MCPCB-Al respectively. It is obviously that the thermal resistance of metal base and the thermal grease cannot be neglected especially in high power application. The structure of PCB-substrate we propose in this paper can reduce the junction temperature about 0.36°C/W compare with MCPCB-substrate. It is a meaningful number for high power LED application.
UR - http://www.scopus.com/inward/record.url?scp=84887932700&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84887932700&partnerID=8YFLogxK
U2 - 10.1109/ICMA.2013.6617910
DO - 10.1109/ICMA.2013.6617910
M3 - Conference contribution
AN - SCOPUS:84887932700
SN - 9781467355582
T3 - 2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013
SP - 158
EP - 163
BT - 2013 IEEE International Conference on Mechatronics and Automation, IEEE ICMA 2013
ER -