Design and test of additive manufacturing for coating thermoplastic PEEK material

C. Y. Liu, Y. W. Hsieh, T. J. Sun, J. W. Zeng, A. B. Wang, N. T. Lee, S. W. Chau, W. C. Wei, Bernard Haochih Liu, R. C. Luo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

3D printing, also known as additive manufacturing, has been considered as the next big thing that can potentially spread as cell phone industry. Nowadays, product resolution restricted by material and fabrication process is ranging from 20 to 300 pm and still has the trends toward higher precision. However, tradeoff between time costs and resolution is always a dilemma in Fused Deposition Modeling (FDM) technique. In contrast, the idea of Laminated Object Manufacturing (LOM) has been applied for rapid prototyping recently. In this work, based on the concept of bond-then-cut, a light and ultra-thin slot die coater has been developed to generate thin and uniform layer of thermoplastic Polyether ether ketone (PEEK) material. By utilizing the suitable flow channel geometry through numerical simulation, PEEK's affinity with substrate, and coating window establishment, we produced 600 mm2 PEEK film with thickness low to 50 pm within a minute, which greatly enhance the manufacturing efficiency. In addition, 10 layered film with 1 mm in thickness has been demonstrated. The success in fabricating PEEK film by the novel design shows its good potential and applicability in additive manufacturing.

Original languageEnglish
Title of host publicationProceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1158-1162
Number of pages5
ISBN (Electronic)9781467380751
DOIs
Publication statusPublished - 2016 May 19
EventIEEE International Conference on Industrial Technology, ICIT 2016 - Taipei, Taiwan
Duration: 2016 Mar 142016 Mar 17

Publication series

NameProceedings of the IEEE International Conference on Industrial Technology
Volume2016-May

Other

OtherIEEE International Conference on Industrial Technology, ICIT 2016
CountryTaiwan
CityTaipei
Period16-03-1416-03-17

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering

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