Abstract
3D printing, also known as additive manufacturing, has been considered as the next big thing that can potentially spread as cell phone industry. Nowadays, product resolution restricted by material and fabrication process is ranging from 20 to 300 pm and still has the trends toward higher precision. However, tradeoff between time costs and resolution is always a dilemma in Fused Deposition Modeling (FDM) technique. In contrast, the idea of Laminated Object Manufacturing (LOM) has been applied for rapid prototyping recently. In this work, based on the concept of bond-then-cut, a light and ultra-thin slot die coater has been developed to generate thin and uniform layer of thermoplastic Polyether ether ketone (PEEK) material. By utilizing the suitable flow channel geometry through numerical simulation, PEEK's affinity with substrate, and coating window establishment, we produced 600 mm2 PEEK film with thickness low to 50 pm within a minute, which greatly enhance the manufacturing efficiency. In addition, 10 layered film with 1 mm in thickness has been demonstrated. The success in fabricating PEEK film by the novel design shows its good potential and applicability in additive manufacturing.
| Original language | English |
|---|---|
| Title of host publication | Proceedings - 2016 IEEE International Conference on Industrial Technology, ICIT 2016 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1158-1162 |
| Number of pages | 5 |
| ISBN (Electronic) | 9781467380751 |
| DOIs | |
| Publication status | Published - 2016 May 19 |
| Event | IEEE International Conference on Industrial Technology, ICIT 2016 - Taipei, Taiwan Duration: 2016 Mar 14 → 2016 Mar 17 |
Publication series
| Name | Proceedings of the IEEE International Conference on Industrial Technology |
|---|---|
| Volume | 2016-May |
Other
| Other | IEEE International Conference on Industrial Technology, ICIT 2016 |
|---|---|
| Country/Territory | Taiwan |
| City | Taipei |
| Period | 16-03-14 → 16-03-17 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
All Science Journal Classification (ASJC) codes
- Computer Science Applications
- Electrical and Electronic Engineering
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