Design, fabrication, and characterization of electroless Ni-P alloy films for micro heating devices

Bernard Haochih Liu, Fang Yi Liao, Jian Hong Chen

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

In this work electroless nickel-phosphorous coatings were used as the micro heaters for scanning thermal microscopy. The deposition of Ni-P alloys not only simplified the microelectromechanical system fabrication steps but also provided flexibility in the tuning of the resistance of the heating elements. Ni-P films were plated on patterned silicon substrates and silicon with a silicon nitride film. The pre-deposition reactive ion etch (RIE) treatment caused a change in surface roughness that enhanced the adhesion of Ni-P coatings. Optimization of RIE parameters and pH values could achieve selective deposition of Ni-P, thus helped the lift-off of a serpentine circuit pattern. The chemical composition and microstructure of Ni-P films affect the electrical properties of micro heaters. Energy-dispersive X-ray spectroscopy identified the Ni-P composition and confirmed its insignificant level of oxidation. The high-temperature X-ray diffraction indicated that the as-deposited film was crystalline Ni, which later transformed into Ni3P at higher temperature. The resistivity of Ni-P films was tailored between 10- 5 and 10- 7 Ω m via a post-deposition annealing, which also obtained a stable temperature coefficient of resistance. Consequently, the performance of micro heaters could be designed with a high degree of flexibility.

Original languageEnglish
Pages (from-to)263-268
Number of pages6
JournalThin Solid Films
Volume537
DOIs
Publication statusPublished - 2013 Jun 30

Fingerprint

Heating
Fabrication
fabrication
heating
heaters
Silicon
flexibility
Ions
nickel coatings
Nickel coatings
Electric heating elements
silicon
Chemical analysis
Silicon nitride
silicon nitrides
Temperature
microelectromechanical systems
MEMS
Microscopic examination
surface roughness

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

@article{6e06cc68c656470aa8188ebb0afb61f5,
title = "Design, fabrication, and characterization of electroless Ni-P alloy films for micro heating devices",
abstract = "In this work electroless nickel-phosphorous coatings were used as the micro heaters for scanning thermal microscopy. The deposition of Ni-P alloys not only simplified the microelectromechanical system fabrication steps but also provided flexibility in the tuning of the resistance of the heating elements. Ni-P films were plated on patterned silicon substrates and silicon with a silicon nitride film. The pre-deposition reactive ion etch (RIE) treatment caused a change in surface roughness that enhanced the adhesion of Ni-P coatings. Optimization of RIE parameters and pH values could achieve selective deposition of Ni-P, thus helped the lift-off of a serpentine circuit pattern. The chemical composition and microstructure of Ni-P films affect the electrical properties of micro heaters. Energy-dispersive X-ray spectroscopy identified the Ni-P composition and confirmed its insignificant level of oxidation. The high-temperature X-ray diffraction indicated that the as-deposited film was crystalline Ni, which later transformed into Ni3P at higher temperature. The resistivity of Ni-P films was tailored between 10- 5 and 10- 7 Ω m via a post-deposition annealing, which also obtained a stable temperature coefficient of resistance. Consequently, the performance of micro heaters could be designed with a high degree of flexibility.",
author = "Liu, {Bernard Haochih} and Liao, {Fang Yi} and Chen, {Jian Hong}",
year = "2013",
month = "6",
day = "30",
doi = "10.1016/j.tsf.2013.04.136",
language = "English",
volume = "537",
pages = "263--268",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",

}

Design, fabrication, and characterization of electroless Ni-P alloy films for micro heating devices. / Liu, Bernard Haochih; Liao, Fang Yi; Chen, Jian Hong.

In: Thin Solid Films, Vol. 537, 30.06.2013, p. 263-268.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Design, fabrication, and characterization of electroless Ni-P alloy films for micro heating devices

AU - Liu, Bernard Haochih

AU - Liao, Fang Yi

AU - Chen, Jian Hong

PY - 2013/6/30

Y1 - 2013/6/30

N2 - In this work electroless nickel-phosphorous coatings were used as the micro heaters for scanning thermal microscopy. The deposition of Ni-P alloys not only simplified the microelectromechanical system fabrication steps but also provided flexibility in the tuning of the resistance of the heating elements. Ni-P films were plated on patterned silicon substrates and silicon with a silicon nitride film. The pre-deposition reactive ion etch (RIE) treatment caused a change in surface roughness that enhanced the adhesion of Ni-P coatings. Optimization of RIE parameters and pH values could achieve selective deposition of Ni-P, thus helped the lift-off of a serpentine circuit pattern. The chemical composition and microstructure of Ni-P films affect the electrical properties of micro heaters. Energy-dispersive X-ray spectroscopy identified the Ni-P composition and confirmed its insignificant level of oxidation. The high-temperature X-ray diffraction indicated that the as-deposited film was crystalline Ni, which later transformed into Ni3P at higher temperature. The resistivity of Ni-P films was tailored between 10- 5 and 10- 7 Ω m via a post-deposition annealing, which also obtained a stable temperature coefficient of resistance. Consequently, the performance of micro heaters could be designed with a high degree of flexibility.

AB - In this work electroless nickel-phosphorous coatings were used as the micro heaters for scanning thermal microscopy. The deposition of Ni-P alloys not only simplified the microelectromechanical system fabrication steps but also provided flexibility in the tuning of the resistance of the heating elements. Ni-P films were plated on patterned silicon substrates and silicon with a silicon nitride film. The pre-deposition reactive ion etch (RIE) treatment caused a change in surface roughness that enhanced the adhesion of Ni-P coatings. Optimization of RIE parameters and pH values could achieve selective deposition of Ni-P, thus helped the lift-off of a serpentine circuit pattern. The chemical composition and microstructure of Ni-P films affect the electrical properties of micro heaters. Energy-dispersive X-ray spectroscopy identified the Ni-P composition and confirmed its insignificant level of oxidation. The high-temperature X-ray diffraction indicated that the as-deposited film was crystalline Ni, which later transformed into Ni3P at higher temperature. The resistivity of Ni-P films was tailored between 10- 5 and 10- 7 Ω m via a post-deposition annealing, which also obtained a stable temperature coefficient of resistance. Consequently, the performance of micro heaters could be designed with a high degree of flexibility.

UR - http://www.scopus.com/inward/record.url?scp=84878317497&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84878317497&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2013.04.136

DO - 10.1016/j.tsf.2013.04.136

M3 - Article

VL - 537

SP - 263

EP - 268

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

ER -