Design, modelling, and characterization of display compatible pMUT device

C. H. Huang, H. Gao, G. B. Torri, S. Mao, Y. Jeong, D. Cheyns, V. Rochus, X. Rottenberg

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

In this paper, the design, modeling, and characterization of a display compatible pMUT platform are presented. A FEM model is built using COMSOL Multiphysics for evaluating the frequency response, mechanical performance, acoustic pressure, and driving efficiency of our pMUT device across all vibration modes of circular plates. In parallel with it, a first mode analytical model has been developed including electrical, mechanical, and acoustic domains to provide fast estimation for future design. A laser Doppler vibrometer is used to measure the frequency response, displacement, velocity as well as mode shapes of pMUTs with different designs in air. The measured resonance frequency of first mode range from 121.5kHz to 1.1MHz with radius from 500μm to 120μm and fits the prediction of FEM and analytical models. A standard reference microphone is used to measure the acoustic pressure of pMUT inside its frequency range (<125 kHz). The measured acoustic pressure on transverse axis of a 500μm radius pMUT also fits the values from analytical model on acoustic domain.

Original languageEnglish
Title of host publication2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
ISBN (Electronic)9781538623596
DOIs
Publication statusPublished - 2018 May 30
Event19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018 - Toulouse, France
Duration: 2018 Apr 152018 Apr 18

Publication series

Name2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018

Other

Other19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018
CountryFrance
CityToulouse
Period18-04-1518-04-18

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Modelling and Simulation
  • Mechanical Engineering

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