Abstract
This paper presents the design and implementation of a 60-GHz compact and low-insertion loss on-chip bandpass filter (BPF) with using a 0.18-μm standard CMOS process. For size reduction, the symmetric short-ended parallel coupled line with cascaded transmission lines is loaded with open-ended two-section stepped-impedance (SI) transmission lines. The final layout structure can be further miniaturized by properly folding the resonators. The measured results show that the fabricated BPF exhibits an insertion loss less than 3 dB and a return loss better than 16 dB. Considering the trade-off between the insertion loss and the band-edge cutoff rate, the transmission zero designed by the SI transmission lines is located at 80 GHz. The chip core size is 0.23 × 0.31 mm2 (0.09 × 0.12 λg2).
| Original language | English |
|---|---|
| Title of host publication | 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 1232-1234 |
| Number of pages | 3 |
| ISBN (Electronic) | 9784902339314 |
| Publication status | Published - 2014 Mar 25 |
| Event | 2014 Asia-Pacific Microwave Conference, APMC 2014 - Sendai, Japan Duration: 2014 Nov 4 → 2014 Nov 7 |
Publication series
| Name | 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014 |
|---|
Other
| Other | 2014 Asia-Pacific Microwave Conference, APMC 2014 |
|---|---|
| Country | Japan |
| City | Sendai |
| Period | 14-11-04 → 14-11-07 |
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All Science Journal Classification (ASJC) codes
- Computer Networks and Communications
- Hardware and Architecture
- Electrical and Electronic Engineering
Cite this
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Design of 60-GHz compact and low-insertion loss stepped-impedance coupled-line CMOS on-chip bandpass filter. / Chuang, Po Kai; Yeh, Lung Kai; Chuang, Huey Ru.
2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 1232-1234 7067621 (2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
TY - GEN
T1 - Design of 60-GHz compact and low-insertion loss stepped-impedance coupled-line CMOS on-chip bandpass filter
AU - Chuang, Po Kai
AU - Yeh, Lung Kai
AU - Chuang, Huey Ru
PY - 2014/3/25
Y1 - 2014/3/25
N2 - This paper presents the design and implementation of a 60-GHz compact and low-insertion loss on-chip bandpass filter (BPF) with using a 0.18-μm standard CMOS process. For size reduction, the symmetric short-ended parallel coupled line with cascaded transmission lines is loaded with open-ended two-section stepped-impedance (SI) transmission lines. The final layout structure can be further miniaturized by properly folding the resonators. The measured results show that the fabricated BPF exhibits an insertion loss less than 3 dB and a return loss better than 16 dB. Considering the trade-off between the insertion loss and the band-edge cutoff rate, the transmission zero designed by the SI transmission lines is located at 80 GHz. The chip core size is 0.23 × 0.31 mm2 (0.09 × 0.12 λg2).
AB - This paper presents the design and implementation of a 60-GHz compact and low-insertion loss on-chip bandpass filter (BPF) with using a 0.18-μm standard CMOS process. For size reduction, the symmetric short-ended parallel coupled line with cascaded transmission lines is loaded with open-ended two-section stepped-impedance (SI) transmission lines. The final layout structure can be further miniaturized by properly folding the resonators. The measured results show that the fabricated BPF exhibits an insertion loss less than 3 dB and a return loss better than 16 dB. Considering the trade-off between the insertion loss and the band-edge cutoff rate, the transmission zero designed by the SI transmission lines is located at 80 GHz. The chip core size is 0.23 × 0.31 mm2 (0.09 × 0.12 λg2).
UR - http://www.scopus.com/inward/record.url?scp=84949092921&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84949092921&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84949092921
T3 - 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014
SP - 1232
EP - 1234
BT - 2014 Asia-Pacific Microwave Conference Proceedings, APMC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
ER -