Design of a rectangular DC magnetron sputtering system with controllable target erosion patterns

Cheng Tsung Liu, Hsiao Chun Yeh, Chih-Wen Chang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

To supply higher deposition rate and better target utilization, simple and cost-effective adjustments that can be applied to the existing DC magnetron sputtering systems are desired. By attaching adequate iron annulus and compensation magnetizations, electron trajectories near the target surface can be confined and the target erosion patterns can then be properly controlled. Hence, the target can be more effectively utilized and the substrate deposition rate can also be indirectly enhanced. Three typical patterns have been selected and promising results have showed that the erosion patterns on the targets can be precisely controlled to the designated reference profiles with resemblances higher than 98.78%, along with the substrate sputtering rate enhancements in the range of 20.87%-23.06%. From such verifications, clearly the refinement concepts for better the system performance can be confirmed.

Original languageEnglish
Title of host publication2011 International Conference on Electrical Machines and Systems, ICEMS 2011
DOIs
Publication statusPublished - 2011 Dec 16
Event2011 International Conference on Electrical Machines and Systems, ICEMS 2011 - Beijing, China
Duration: 2011 Aug 202011 Aug 23

Publication series

Name2011 International Conference on Electrical Machines and Systems, ICEMS 2011

Other

Other2011 International Conference on Electrical Machines and Systems, ICEMS 2011
CountryChina
CityBeijing
Period11-08-2011-08-23

Fingerprint

Deposition rates
Magnetron sputtering
Erosion
Substrates
Sputtering
Magnetization
Trajectories
Iron
Electrons
Costs
Compensation and Redress

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Liu, C. T., Yeh, H. C., & Chang, C-W. (2011). Design of a rectangular DC magnetron sputtering system with controllable target erosion patterns. In 2011 International Conference on Electrical Machines and Systems, ICEMS 2011 [6073343] (2011 International Conference on Electrical Machines and Systems, ICEMS 2011). https://doi.org/10.1109/ICEMS.2011.6073343
Liu, Cheng Tsung ; Yeh, Hsiao Chun ; Chang, Chih-Wen. / Design of a rectangular DC magnetron sputtering system with controllable target erosion patterns. 2011 International Conference on Electrical Machines and Systems, ICEMS 2011. 2011. (2011 International Conference on Electrical Machines and Systems, ICEMS 2011).
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Liu, CT, Yeh, HC & Chang, C-W 2011, Design of a rectangular DC magnetron sputtering system with controllable target erosion patterns. in 2011 International Conference on Electrical Machines and Systems, ICEMS 2011., 6073343, 2011 International Conference on Electrical Machines and Systems, ICEMS 2011, 2011 International Conference on Electrical Machines and Systems, ICEMS 2011, Beijing, China, 11-08-20. https://doi.org/10.1109/ICEMS.2011.6073343

Design of a rectangular DC magnetron sputtering system with controllable target erosion patterns. / Liu, Cheng Tsung; Yeh, Hsiao Chun; Chang, Chih-Wen.

2011 International Conference on Electrical Machines and Systems, ICEMS 2011. 2011. 6073343 (2011 International Conference on Electrical Machines and Systems, ICEMS 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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N2 - To supply higher deposition rate and better target utilization, simple and cost-effective adjustments that can be applied to the existing DC magnetron sputtering systems are desired. By attaching adequate iron annulus and compensation magnetizations, electron trajectories near the target surface can be confined and the target erosion patterns can then be properly controlled. Hence, the target can be more effectively utilized and the substrate deposition rate can also be indirectly enhanced. Three typical patterns have been selected and promising results have showed that the erosion patterns on the targets can be precisely controlled to the designated reference profiles with resemblances higher than 98.78%, along with the substrate sputtering rate enhancements in the range of 20.87%-23.06%. From such verifications, clearly the refinement concepts for better the system performance can be confirmed.

AB - To supply higher deposition rate and better target utilization, simple and cost-effective adjustments that can be applied to the existing DC magnetron sputtering systems are desired. By attaching adequate iron annulus and compensation magnetizations, electron trajectories near the target surface can be confined and the target erosion patterns can then be properly controlled. Hence, the target can be more effectively utilized and the substrate deposition rate can also be indirectly enhanced. Three typical patterns have been selected and promising results have showed that the erosion patterns on the targets can be precisely controlled to the designated reference profiles with resemblances higher than 98.78%, along with the substrate sputtering rate enhancements in the range of 20.87%-23.06%. From such verifications, clearly the refinement concepts for better the system performance can be confirmed.

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Liu CT, Yeh HC, Chang C-W. Design of a rectangular DC magnetron sputtering system with controllable target erosion patterns. In 2011 International Conference on Electrical Machines and Systems, ICEMS 2011. 2011. 6073343. (2011 International Conference on Electrical Machines and Systems, ICEMS 2011). https://doi.org/10.1109/ICEMS.2011.6073343