TY - GEN
T1 - Design optimization for wafer level package reliability by using artificial neural network
AU - Lai, P. C.
AU - Chiu, Tz-Cheng
AU - Shen, G. S.
PY - 2013/12/1
Y1 - 2013/12/1
N2 - An artificial neural network (ANN) based multi-objective design optimization for a wafer level package (WLP) is presented. Design factors including bump pad configuration, solder alloy composition, bump pad opening diameter, pad overhang (Cu pad radius minus pad opening radius), redistribution layer (RDL) polymer dielectric thickness and under-bump Cu thickness are grouped and considered by using a 3-level full factorial design of simulations (DoS) procedure. Key failure indices corresponding to solder joint fatigue fracture, RDL trace fatigue fracture and polymer dielectric cracking are selected as the objective functions for the design optimization. The Pareto optimal solutions are determined by using a genetic algorithm, and the compromise programming method is applied to determine the most reliable design.
AB - An artificial neural network (ANN) based multi-objective design optimization for a wafer level package (WLP) is presented. Design factors including bump pad configuration, solder alloy composition, bump pad opening diameter, pad overhang (Cu pad radius minus pad opening radius), redistribution layer (RDL) polymer dielectric thickness and under-bump Cu thickness are grouped and considered by using a 3-level full factorial design of simulations (DoS) procedure. Key failure indices corresponding to solder joint fatigue fracture, RDL trace fatigue fracture and polymer dielectric cracking are selected as the objective functions for the design optimization. The Pareto optimal solutions are determined by using a genetic algorithm, and the compromise programming method is applied to determine the most reliable design.
UR - http://www.scopus.com/inward/record.url?scp=84893965515&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84893965515&partnerID=8YFLogxK
U2 - 10.1109/IMPACT.2013.6706665
DO - 10.1109/IMPACT.2013.6706665
M3 - Conference contribution
AN - SCOPUS:84893965515
SN - 9781479906673
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 172
EP - 175
BT - 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud
T2 - 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Green and Cloud: Creating Value and Toward Eco-Life, IMPACT 2013
Y2 - 22 October 2013 through 25 October 2013
ER -