Determination of residual stress of hard film/soft substrate specimens via unloading results of nanoindentation tests

Huu Hung Nguyen, Pal Jen Wei, Jen Fin Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A method used to determine the residual stress in a hard film deposited on a soft substrate via the unloading load-depth curves was proposed. The unloading curves with transitional behaviors were used to determine the film deflection stiffness, and then the residual stresses were obtained. Significant extra stresses were induced by a cube corner indenter at large depth. In contrast, the indentation-induced stresses could be neglected in cases of Berkovich indentation at relatively small depths.

Original languageEnglish
Title of host publicationMechatronics and Materials Processing I
Pages843-848
Number of pages6
DOIs
Publication statusPublished - 2011
Event2011 International Conference on Mechatronics and Materials Processing, ICMMP 2011 - Guangzhou, China
Duration: 2011 Nov 182011 Nov 20

Publication series

NameAdvanced Materials Research
Volume328-330
ISSN (Print)1022-6680

Other

Other2011 International Conference on Mechatronics and Materials Processing, ICMMP 2011
CountryChina
CityGuangzhou
Period11-11-1811-11-20

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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