Determining buckling strain energy release rate through indentation-induced delamination

Pal Jen Wei, Sheng Bin Chio, Wen Long Liang, Jen Fin Lin

Research output: Contribution to journalArticlepeer-review

9 Citations (Scopus)


An oscillating indentation load was applied to delaminate a diamond-like-carbon film from a silicon substrate. After delamination occurred, a two-stage behavior was exhibited in the load-depth results; then, a three-stage behavior was exhibited after buckling occurred due to a long enough delamination length. After removing the indentation load, the debonding film was single-buckled and suspended over the substrate; thus, the delamination length was obtained via the residual profile. Through analysis of the deflection of the buckled film, the buckling strain energy release rate was evaluated.

Original languageEnglish
Pages (from-to)4889-4893
Number of pages5
JournalThin Solid Films
Issue number15
Publication statusPublished - 2011 May 31

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry


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