TY - GEN
T1 - Development and Validation of a Semi-Analytical Model for Predicting Asymmetric Warpage of Fan-Out Reconstituting Packaging
AU - Lee, Yu Chin
AU - Chen, Chia Yu
AU - Chen, Yi Sheng
AU - Chen, Kuo Shen
AU - Chen, Tang Yuan
AU - Chen, Dao Lung
AU - Tarng, David
N1 - Funding Information:
This work is supported by Ministry of Science and Technology (MOST) of Taiwan under the contracts MOST-109 -2221-E-006 -096 and Advanced Semiconductor Engineering, Inc. under the contract B109 -K833.
Funding Information:
This work is supported by Ministry of Science and Technology (MOST) of Taiwan under the contracts MOST-109-2221-E-006-096 and Advanced Semiconductor Engineering, Inc. under the contract B109-K833.
Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - Fan-out wafer level package (FOWLP) are widely used in advanced packaging technologies. In modeling or curing phases the reconstituted wafers may warp asymmetrically due to numerous thermal and mechanical loadings. Such excessive warpages further impose concerns in subsequent processing and the final yielding and reliability of products. Therefore, it is desirable to develop an efficient evaluation to correlate the bifurcation of asymmetric warping. In this paper, the semi-analytical model is proposed for providing onset temperature of bifurcation prediction. And the finite element simulation of full-scale model serving as the standard reference in the entire work. Consequently, comparing with finite element result and the semi-analytical model prediction with several equivalent strategies, the semi-analytical model with energy method shows highly consistent with the full-scale model in bifurcation temperature.
AB - Fan-out wafer level package (FOWLP) are widely used in advanced packaging technologies. In modeling or curing phases the reconstituted wafers may warp asymmetrically due to numerous thermal and mechanical loadings. Such excessive warpages further impose concerns in subsequent processing and the final yielding and reliability of products. Therefore, it is desirable to develop an efficient evaluation to correlate the bifurcation of asymmetric warping. In this paper, the semi-analytical model is proposed for providing onset temperature of bifurcation prediction. And the finite element simulation of full-scale model serving as the standard reference in the entire work. Consequently, comparing with finite element result and the semi-analytical model prediction with several equivalent strategies, the semi-analytical model with energy method shows highly consistent with the full-scale model in bifurcation temperature.
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U2 - 10.1109/IMPACT53160.2021.9696476
DO - 10.1109/IMPACT53160.2021.9696476
M3 - Conference contribution
AN - SCOPUS:85126235307
T3 - Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
SP - 123
EP - 126
BT - 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2021 - Proceedings
PB - IEEE Computer Society
T2 - 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2021
Y2 - 21 December 2021 through 23 December 2021
ER -