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Development and Validation of a Semi-Analytical Model for Predicting Asymmetric Warpage of Fan-Out Reconstituting Packaging
Yu Chin Lee, Chia Yu Chen, Yi Sheng Chen, Kuo Shen Chen, Tang Yuan Chen, Dao Lung Chen, David Tarng
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2
Citations
(Scopus)