Development of a consistent multiaxial viscoelastic model for package warpage simulation

Tz-Cheng Chiu, Dong Yi Huang, Bo Sheng Lee, Dao Long Chen, Ping Feng Yang, Chin Li Kao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

A procedure for constructing the three-dimensional viscoelastic constitutive model of polymeric packaging material over a wide range of temperatures is presented. By using both tensile and torsional dynamic mechanical analyses (DMA) and thermal mechanical analyses (TMA), the viscoelastic constitutive behavior of a low-filler-percentage epoxy molding compound (EMC) was first characterized. Storage modulus mastercurves obtained from the DMA were converted to the relaxation moduli in the Laplace-Carson transform domain. The transformed Young's and shear relaxation moduli were then curve fitted by using an optimization procedure with restriction for ensuring physically admissible time-dependent Poisson's ratio. Bulk and shear relaxation moduli were then obtained from the fitted moduli and inverse transformed to the time domain. A numerical finite element model that considers the viscoelastic constitutive behavior of EMC was applied to simulate warpage of an overmolded flip-chip package under the surface mount solder reflow process and compared to experimental shadow Moiré measurements for validating the constitutive model.

Original languageEnglish
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages373-379
Number of pages7
ISBN (Electronic)9781479986095
DOIs
Publication statusPublished - 2015 Jul 15
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: 2015 May 262015 May 29

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2015-July
ISSN (Print)0569-5503

Other

Other2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
CountryUnited States
CitySan Diego
Period15-05-2615-05-29

Fingerprint

Sheet molding compounds
Constitutive models
Packaging materials
Laplace transforms
Poisson ratio
Soldering alloys
Fillers
Elastic moduli
Polymers
Temperature
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Chiu, T-C., Huang, D. Y., Lee, B. S., Chen, D. L., Yang, P. F., & Kao, C. L. (2015). Development of a consistent multiaxial viscoelastic model for package warpage simulation. In 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015 (pp. 373-379). [7159620] (Proceedings - Electronic Components and Technology Conference; Vol. 2015-July). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2015.7159620
Chiu, Tz-Cheng ; Huang, Dong Yi ; Lee, Bo Sheng ; Chen, Dao Long ; Yang, Ping Feng ; Kao, Chin Li. / Development of a consistent multiaxial viscoelastic model for package warpage simulation. 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 373-379 (Proceedings - Electronic Components and Technology Conference).
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abstract = "A procedure for constructing the three-dimensional viscoelastic constitutive model of polymeric packaging material over a wide range of temperatures is presented. By using both tensile and torsional dynamic mechanical analyses (DMA) and thermal mechanical analyses (TMA), the viscoelastic constitutive behavior of a low-filler-percentage epoxy molding compound (EMC) was first characterized. Storage modulus mastercurves obtained from the DMA were converted to the relaxation moduli in the Laplace-Carson transform domain. The transformed Young's and shear relaxation moduli were then curve fitted by using an optimization procedure with restriction for ensuring physically admissible time-dependent Poisson's ratio. Bulk and shear relaxation moduli were then obtained from the fitted moduli and inverse transformed to the time domain. A numerical finite element model that considers the viscoelastic constitutive behavior of EMC was applied to simulate warpage of an overmolded flip-chip package under the surface mount solder reflow process and compared to experimental shadow Moir{\'e} measurements for validating the constitutive model.",
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Chiu, T-C, Huang, DY, Lee, BS, Chen, DL, Yang, PF & Kao, CL 2015, Development of a consistent multiaxial viscoelastic model for package warpage simulation. in 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015., 7159620, Proceedings - Electronic Components and Technology Conference, vol. 2015-July, Institute of Electrical and Electronics Engineers Inc., pp. 373-379, 2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015, San Diego, United States, 15-05-26. https://doi.org/10.1109/ECTC.2015.7159620

Development of a consistent multiaxial viscoelastic model for package warpage simulation. / Chiu, Tz-Cheng; Huang, Dong Yi; Lee, Bo Sheng; Chen, Dao Long; Yang, Ping Feng; Kao, Chin Li.

2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 373-379 7159620 (Proceedings - Electronic Components and Technology Conference; Vol. 2015-July).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chiu T-C, Huang DY, Lee BS, Chen DL, Yang PF, Kao CL. Development of a consistent multiaxial viscoelastic model for package warpage simulation. In 2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 373-379. 7159620. (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2015.7159620