TY - GEN
T1 - Development of a dual-phase virtual metrology scheme
AU - Cheng, Fan Tien
AU - Huang, Hsien Cheng
AU - Kao, Chi An
PY - 2007/12/1
Y1 - 2007/12/1
N2 - This work proposes a Dual-phase virtual metrology scheme. To consider both promptness and accuracy, this scheme generates dual-phase virtual metrology (VM) values. Phase I emphasizes promptness; that is to immediately calculate and output the Phase-I VM value (denoted VMI) of a workpiece (wafer or glass) once the entire process data of the workpiece are completely collected. Phase II intensifies accuracy; that is not to re-calculate and output the Phase-II VM values (denoted VMII) of all the workpieces in the cassette (also called FOUP in the semiconductor industry) until an actual metrology value (required for tuning or re-training purposes) of a workpiece in the same cassette is collected. Besides, in this scheme, the accompanying reliance index (RI) and global similarity index (GSI) of each VMI and VMII are also generated. The RI and GSI are applied to gauge the degree of reliance. If the reliance level of a VM value is lower than the threshold, this VM value may not be adopted. An illustrative example involving fifth-generation TFT-LCD CVD equipment is presented. Experimental results demonstrate that the proposed scheme is applicable to the wafer-to-wafer or glass-to-glass advanced process control for semiconductor or TFT-LCD factories.
AB - This work proposes a Dual-phase virtual metrology scheme. To consider both promptness and accuracy, this scheme generates dual-phase virtual metrology (VM) values. Phase I emphasizes promptness; that is to immediately calculate and output the Phase-I VM value (denoted VMI) of a workpiece (wafer or glass) once the entire process data of the workpiece are completely collected. Phase II intensifies accuracy; that is not to re-calculate and output the Phase-II VM values (denoted VMII) of all the workpieces in the cassette (also called FOUP in the semiconductor industry) until an actual metrology value (required for tuning or re-training purposes) of a workpiece in the same cassette is collected. Besides, in this scheme, the accompanying reliance index (RI) and global similarity index (GSI) of each VMI and VMII are also generated. The RI and GSI are applied to gauge the degree of reliance. If the reliance level of a VM value is lower than the threshold, this VM value may not be adopted. An illustrative example involving fifth-generation TFT-LCD CVD equipment is presented. Experimental results demonstrate that the proposed scheme is applicable to the wafer-to-wafer or glass-to-glass advanced process control for semiconductor or TFT-LCD factories.
UR - http://www.scopus.com/inward/record.url?scp=44449160045&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=44449160045&partnerID=8YFLogxK
U2 - 10.1109/COASE.2007.4341679
DO - 10.1109/COASE.2007.4341679
M3 - Conference contribution
AN - SCOPUS:44449160045
SN - 1424411548
SN - 9781424411542
T3 - Proceedings of the 3rd IEEE International Conference on Automation Science and Engineering, IEEE CASE 2007
SP - 270
EP - 275
BT - Proceedings of the 3rd IEEE International Conference on Automation Science and Engineering, IEEE CASE 2007
T2 - 3rd IEEE International Conference on Automation Science and Engineering, IEEE CASE 2007
Y2 - 22 September 2007 through 25 September 2007
ER -