Development of a microelectromechanical system pressure sensor for rehabilitation engineering applications

Jyh Jier Ho, Y. K. Fang, M. C. Hsieh, S. F. Ting, G. S. Chen, M. S. Ju, Terry Y. Chen, C. R. Huang, C. Y. Chen

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Abstract

Based on computer finite-element analysis ANSYS 5.3 and microelectromechanical systems (MEMS) technologies, a micropressure sensor was designed and fabricated. The sensor can be used to measure the distribution of normal stress between soft tissues on an above-knee amputee'S skin and the contacting surface of a rehabilitation device. A square membrane with dimensions 2400μm × 2400μm × 80μm is formed by backside photolithography and wet etching of an n-type 〈100〉 monolithic silicon wafer. On the middle of the membrane edge, an X-shaped silicon wafer was implanted with boron ions and then enhanced by diffusion to form a piezoresistive strain gauge. In the design process, a finite-element method is used to analyse the effects of pressure sensitivity and its temperature coefficients. The developed micropressure sensors, which have smaller weight and volume than a conventional machine type, perform well and fit our design specifications.

Original languageEnglish
Pages (from-to)757-767
Number of pages11
JournalInternational Journal of Electronics
Volume87
Issue number6
DOIs
Publication statusPublished - 2000 Jun

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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