Abstract
Based on computer finite-element analysis ANSYS 5.3 and microelectromechanical systems (MEMS) technologies, a micropressure sensor was designed and fabricated. The sensor can be used to measure the distribution of normal stress between soft tissues on an above-knee amputee'S skin and the contacting surface of a rehabilitation device. A square membrane with dimensions 2400μm × 2400μm × 80μm is formed by backside photolithography and wet etching of an n-type 〈100〉 monolithic silicon wafer. On the middle of the membrane edge, an X-shaped silicon wafer was implanted with boron ions and then enhanced by diffusion to form a piezoresistive strain gauge. In the design process, a finite-element method is used to analyse the effects of pressure sensitivity and its temperature coefficients. The developed micropressure sensors, which have smaller weight and volume than a conventional machine type, perform well and fit our design specifications.
Original language | English |
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Pages (from-to) | 757-767 |
Number of pages | 11 |
Journal | International Journal of Electronics |
Volume | 87 |
Issue number | 6 |
DOIs | |
Publication status | Published - 2000 Jun |
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering