Development of a Novel Biomaterial for Spinal Implant Purpose

Kazuma Kishimoto; Shuichi Shoji; Jun Mizuno

doi:10.23919/ICEP55381.2022.9795614

Development of a Novel Biomaterial for Spinal Implant Purpose

Kazuma Kishimoto, Shuichi Shoji, Jun Mizuno

Program on Smart and Sustainable Manufacturing

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In this study, we have successfully fabricated a novel biomaterial polymer, possessing a 3D microarchitecture, with a simple and inexpensive manufacturing process. This biomaterial is a polydimethylsiloxane (PDMS) and poly(ether) ether ketone (PEEK) composites, which possesses highly porous structure, mimicking the mechanical and heterogeneous properties of the human body. For biocompatible approaches, a thin film of TiO2 was deposited on the surface of the polymer using atomic layer deposition (ALD). Based on scanning electron microscopy analysis, universal tensile testing and x-ray photoelectron spectroscopy analysis, it was confirmed that this novel biomaterial has a high potential of becoming a spinal implant material in the future.

Original language	English
Title of host publication	2022 International Conference on Electronics Packaging, ICEP 2022
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	85-86
Number of pages	2
ISBN (Electronic)	9784991191138
DOIs	https://doi.org/10.23919/ICEP55381.2022.9795614
Publication status	Published - 2022
Event	21st International Conference on Electronics Packaging, ICEP 2022 - Sapporo, Japan Duration: 2022 May 11 → 2022 May 14

Publication series

Name	2022 International Conference on Electronics Packaging, ICEP 2022

Conference

Conference	21st International Conference on Electronics Packaging, ICEP 2022
Country/Territory	Japan
City	Sapporo
Period	22-05-11 → 22-05-14

All Science Journal Classification (ASJC) codes

Process Chemistry and Technology
Electrical and Electronic Engineering
Industrial and Manufacturing Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.23919/ICEP55381.2022.9795614

Cite this

@inproceedings{f33ccbf107804435a7559fdffe856d3e,

title = "Development of a Novel Biomaterial for Spinal Implant Purpose",

abstract = "In this study, we have successfully fabricated a novel biomaterial polymer, possessing a 3D microarchitecture, with a simple and inexpensive manufacturing process. This biomaterial is a polydimethylsiloxane (PDMS) and poly(ether) ether ketone (PEEK) composites, which possesses highly porous structure, mimicking the mechanical and heterogeneous properties of the human body. For biocompatible approaches, a thin film of TiO2 was deposited on the surface of the polymer using atomic layer deposition (ALD). Based on scanning electron microscopy analysis, universal tensile testing and x-ray photoelectron spectroscopy analysis, it was confirmed that this novel biomaterial has a high potential of becoming a spinal implant material in the future.",

author = "Kazuma Kishimoto and Shuichi Shoji and Jun Mizuno",

note = "Publisher Copyright: {\textcopyright} 2022 Japan Institute of Electronics Packaging.; 21st International Conference on Electronics Packaging, ICEP 2022 ; Conference date: 11-05-2022 Through 14-05-2022",

year = "2022",

doi = "10.23919/ICEP55381.2022.9795614",

language = "English",

series = "2022 International Conference on Electronics Packaging, ICEP 2022",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "85--86",

booktitle = "2022 International Conference on Electronics Packaging, ICEP 2022",

address = "United States",

}

Kishimoto, K, Shoji, S & Mizuno, J 2022, Development of a Novel Biomaterial for Spinal Implant Purpose. in 2022 International Conference on Electronics Packaging, ICEP 2022. 2022 International Conference on Electronics Packaging, ICEP 2022, Institute of Electrical and Electronics Engineers Inc., pp. 85-86, 21st International Conference on Electronics Packaging, ICEP 2022, Sapporo, Japan, 22-05-11. https://doi.org/10.23919/ICEP55381.2022.9795614

Development of a Novel Biomaterial for Spinal Implant Purpose. / Kishimoto, Kazuma; Shoji, Shuichi; Mizuno, Jun.
2022 International Conference on Electronics Packaging, ICEP 2022. Institute of Electrical and Electronics Engineers Inc., 2022. p. 85-86 (2022 International Conference on Electronics Packaging, ICEP 2022).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Development of a Novel Biomaterial for Spinal Implant Purpose

AU - Kishimoto, Kazuma

AU - Shoji, Shuichi

AU - Mizuno, Jun

PY - 2022

Y1 - 2022

N2 - In this study, we have successfully fabricated a novel biomaterial polymer, possessing a 3D microarchitecture, with a simple and inexpensive manufacturing process. This biomaterial is a polydimethylsiloxane (PDMS) and poly(ether) ether ketone (PEEK) composites, which possesses highly porous structure, mimicking the mechanical and heterogeneous properties of the human body. For biocompatible approaches, a thin film of TiO2 was deposited on the surface of the polymer using atomic layer deposition (ALD). Based on scanning electron microscopy analysis, universal tensile testing and x-ray photoelectron spectroscopy analysis, it was confirmed that this novel biomaterial has a high potential of becoming a spinal implant material in the future.

AB - In this study, we have successfully fabricated a novel biomaterial polymer, possessing a 3D microarchitecture, with a simple and inexpensive manufacturing process. This biomaterial is a polydimethylsiloxane (PDMS) and poly(ether) ether ketone (PEEK) composites, which possesses highly porous structure, mimicking the mechanical and heterogeneous properties of the human body. For biocompatible approaches, a thin film of TiO2 was deposited on the surface of the polymer using atomic layer deposition (ALD). Based on scanning electron microscopy analysis, universal tensile testing and x-ray photoelectron spectroscopy analysis, it was confirmed that this novel biomaterial has a high potential of becoming a spinal implant material in the future.

UR - http://www.scopus.com/inward/record.url?scp=85133366816&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85133366816&partnerID=8YFLogxK

U2 - 10.23919/ICEP55381.2022.9795614

DO - 10.23919/ICEP55381.2022.9795614

M3 - Conference contribution

AN - SCOPUS:85133366816

T3 - 2022 International Conference on Electronics Packaging, ICEP 2022

SP - 85

EP - 86

BT - 2022 International Conference on Electronics Packaging, ICEP 2022

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 21st International Conference on Electronics Packaging, ICEP 2022

Y2 - 11 May 2022 through 14 May 2022

ER -

Development of a Novel Biomaterial for Spinal Implant Purpose

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All Science Journal Classification (ASJC) codes

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