Development of a Thermoelectric Energy Generator Chip of Small Layout and High Power/Voltage Factors by Foundry Service

Shih-Ming Yang, J. Y. Wang, M. D. Chen, M. H. Tsai

Research output: Contribution to journalArticle

Abstract

Thermoelectric energy generator (TEG) is a device which is used to convert temperature difference between the hot and cold junctions into electrical energy. This paper aims at developing a TEG chip of small layout 5 mm2 having three 2.01 mm ×0.72 mm cells in a total of 10 080 thermocouples by semiconductor foundry service (TSMC) for the advantages in batch production, low cost, and scalability. The design has the unique features to improve TEG performance by having (1) thin-film polycrystalline silicon-germanium Si0.9Ge0.1 layer for higher thermoelectric conversion efficiency, (2) isolation cavity for better thermal insulation, and (3) structural support for improved thermocouple dimensional stability. It is shown that the TEG chip can deliver power factor 0.125μ W/cm2K2 and voltage factor 25.91 V/cm2 K. The experimental verification demonstrates that the 5 mm2 chip has output power 2.083μ W and voltage 3.4 V at 20 K temperature gradient. This is by far the TEG design with best thermoelectric performance implemented by the semiconductor foundry service.

Original languageEnglish
Article number8743440
Pages (from-to)9149-9155
Number of pages7
JournalIEEE Sensors Journal
Volume19
Issue number20
DOIs
Publication statusPublished - 2019 Oct 15

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foundries
Foundries
Thermocouples
layouts
generators
chips
Semiconductor materials
Dimensional stability
Thermal insulation
Electric potential
electric potential
Germanium
Polysilicon
Thermal gradients
Conversion efficiency
Scalability
thermocouples
temperature gradients
Thin films
energy

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Electrical and Electronic Engineering

Cite this

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Development of a Thermoelectric Energy Generator Chip of Small Layout and High Power/Voltage Factors by Foundry Service. / Yang, Shih-Ming; Wang, J. Y.; Chen, M. D.; Tsai, M. H.

In: IEEE Sensors Journal, Vol. 19, No. 20, 8743440, 15.10.2019, p. 9149-9155.

Research output: Contribution to journalArticle

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