Development of an apparatus for measuring normal adhesion force during TPU injection molding process

Jian Yu Chen, Sheng-Jye Hwang, Huei-Huang Lee, Durn Yuan Huang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In integrated circuit (IC) packaging encapsulation, epoxy molding compound (EMC) adheres to mold surface after curing process. This phenomenon is called mold adhesion effect and it happens not only to thermosetting material but also to thermoplastic material. In injection molding process, mold adhesion phenomenon affects demolding process seriously. In order to decrease adhesive force between mold surface and product, release agent was usually applied to improve the adhesion problem, but the mold release agent will make the de-mold efficiency poor and possible flow marks on product surface if the release agent was not applied uniformly. In addition, the design of ejection mechanism will be tougher for separating product from mold surface if the mold adhesion phenomenon is serious. The productivity of a process will decrease and defect rate will increase. In this study, a mechanism designed with a mold that could measure normal adhesion force in injection molding process was successfully developed. The apparatus quantified the normal adhesion force. So engineers can use the measured adhesion force to understand the effectiveness of mold release agent and adhesion release coating. In this study, three different surface roughness (Ra) conditions were compared. It was found that when Ra=0.08μm without coating, the smallest normal adhesion force would obtained. It was found that single-layer CrN coating and modifying CrN coating were effective in reducing the normal adhesion force and multi-layer CrN was not effective. In addition, normal adhesion force was directly proportional to ejecting speed, melt temperature and cooling time.

Original languageEnglish
Title of host publication69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011
Pages1512-1517
Number of pages6
Publication statusPublished - 2011 Aug 23
Event69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011 - Boston, MA, United States
Duration: 2011 May 12011 May 5

Publication series

NameAnnual Technical Conference - ANTEC, Conference Proceedings
Volume2

Other

Other69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011
CountryUnited States
CityBoston, MA
Period11-05-0111-05-05

Fingerprint

Injection molding
Adhesion
Mold release agents
Coatings
Sheet molding compounds
Encapsulation
Thermoplastics
Integrated circuits
Curing
Adhesives
Packaging
Productivity
Surface roughness
Cooling
Engineers
Defects

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Polymers and Plastics

Cite this

Chen, J. Y., Hwang, S-J., Lee, H-H., & Huang, D. Y. (2011). Development of an apparatus for measuring normal adhesion force during TPU injection molding process. In 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011 (pp. 1512-1517). (Annual Technical Conference - ANTEC, Conference Proceedings; Vol. 2).
Chen, Jian Yu ; Hwang, Sheng-Jye ; Lee, Huei-Huang ; Huang, Durn Yuan. / Development of an apparatus for measuring normal adhesion force during TPU injection molding process. 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011. 2011. pp. 1512-1517 (Annual Technical Conference - ANTEC, Conference Proceedings).
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abstract = "In integrated circuit (IC) packaging encapsulation, epoxy molding compound (EMC) adheres to mold surface after curing process. This phenomenon is called mold adhesion effect and it happens not only to thermosetting material but also to thermoplastic material. In injection molding process, mold adhesion phenomenon affects demolding process seriously. In order to decrease adhesive force between mold surface and product, release agent was usually applied to improve the adhesion problem, but the mold release agent will make the de-mold efficiency poor and possible flow marks on product surface if the release agent was not applied uniformly. In addition, the design of ejection mechanism will be tougher for separating product from mold surface if the mold adhesion phenomenon is serious. The productivity of a process will decrease and defect rate will increase. In this study, a mechanism designed with a mold that could measure normal adhesion force in injection molding process was successfully developed. The apparatus quantified the normal adhesion force. So engineers can use the measured adhesion force to understand the effectiveness of mold release agent and adhesion release coating. In this study, three different surface roughness (Ra) conditions were compared. It was found that when Ra=0.08μm without coating, the smallest normal adhesion force would obtained. It was found that single-layer CrN coating and modifying CrN coating were effective in reducing the normal adhesion force and multi-layer CrN was not effective. In addition, normal adhesion force was directly proportional to ejecting speed, melt temperature and cooling time.",
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Chen, JY, Hwang, S-J, Lee, H-H & Huang, DY 2011, Development of an apparatus for measuring normal adhesion force during TPU injection molding process. in 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011. Annual Technical Conference - ANTEC, Conference Proceedings, vol. 2, pp. 1512-1517, 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011, Boston, MA, United States, 11-05-01.

Development of an apparatus for measuring normal adhesion force during TPU injection molding process. / Chen, Jian Yu; Hwang, Sheng-Jye; Lee, Huei-Huang; Huang, Durn Yuan.

69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011. 2011. p. 1512-1517 (Annual Technical Conference - ANTEC, Conference Proceedings; Vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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M3 - Conference contribution

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Chen JY, Hwang S-J, Lee H-H, Huang DY. Development of an apparatus for measuring normal adhesion force during TPU injection molding process. In 69th Annual Technical Conference of the Society of Plastics Engineers 2011, ANTEC 2011. 2011. p. 1512-1517. (Annual Technical Conference - ANTEC, Conference Proceedings).