Development of consistent interconversions between linear viscoelastic functions for multiaxial viscoelastic models

Dao Long Chen, Tz Cheng Chiu, Shu Hua Lee, Po Hsien Sung, Meng Kai Shih, David Tarng, Chih Pin Hung

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Characterizations for the comprehensive viscoelastic behaviors of materials were conducted in this research. For considering the multiaxial viscoelastic behaviors of the polymeric constituents in finite element models for package stress and deformation simulations, it is required to construct the mathematical models of the viscoelastic bulk and shear relaxation moduli. In order to obtain the consistent viscoelastic functions, the interconversion relations were developed and applied as a new fitting procedure. By using the consistently fitted values of viscoelastic bulk and shear relaxation moduli, the constitutive behaviors of organic packaging materials by using time-dependent viscoelastic models for warpage predictions could be more accurate.

Original languageEnglish
Title of host publicationIMPACT 2017 - 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, Proceedings
PublisherIEEE Computer Society
Pages282-285
Number of pages4
ISBN (Electronic)9781538647196
DOIs
Publication statusPublished - 2017 Jul 1
Event12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017 - Taipei, Taiwan
Duration: 2017 Oct 252017 Oct 27

Publication series

NameProceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
Volume2017-October
ISSN (Print)2150-5934
ISSN (Electronic)2150-5942

Other

Other12th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2017
CountryTaiwan
CityTaipei
Period17-10-2517-10-27

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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