Development of device-level chemical-mechanical polishing simulation module using cellular automata method

Hsiu Ming Yeh, Kuo Shen Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work briefly presents the basic theory, the development, and a primary demonstration of a device-level chemical-Mechanical Polishing (CMP) CAD module. By integrating the phenomenological material removing relation such as Preston's equation, contact mechanics, finite element analysis, with a cellular automata environment, this CMP CAD aims to predict the rounding, dishing, and erosion effects commonly observed in modern copper CMP processes. Primary results indicate that this CAD can essentially catch the characteristics of polishing processes. Further modification of this CAD would enhance its accuracy for industrial applications.

Original languageEnglish
Title of host publicationNanotechnology 2010
Subtitle of host publicationElectronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010
Pages669-672
Number of pages4
Publication statusPublished - 2010 Nov 9
EventNanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010 - Anaheim, CA, United States
Duration: 2010 Jun 212010 Jun 24

Publication series

NameNanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010
Volume2

Other

OtherNanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010
CountryUnited States
CityAnaheim, CA
Period10-06-2110-06-24

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Yeh, H. M., & Chen, K. S. (2010). Development of device-level chemical-mechanical polishing simulation module using cellular automata method. In Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010 (pp. 669-672). (Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010; Vol. 2).