Development of device-level chemical-mechanical polishing simulation module using cellular automata method

Hsiu Ming Yeh; Kuo Shen Chen

Development of device-level chemical-mechanical polishing simulation module using cellular automata method

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This work briefly presents the basic theory, the development, and a primary demonstration of a device-level chemical-Mechanical Polishing (CMP) CAD module. By integrating the phenomenological material removing relation such as Preston's equation, contact mechanics, finite element analysis, with a cellular automata environment, this CMP CAD aims to predict the rounding, dishing, and erosion effects commonly observed in modern copper CMP processes. Primary results indicate that this CAD can essentially catch the characteristics of polishing processes. Further modification of this CAD would enhance its accuracy for industrial applications.

Original language	English
Title of host publication	Nanotechnology 2010
Subtitle of host publication	Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010
Pages	669-672
Number of pages	4
Publication status	Published - 2010
Event	Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010 - Anaheim, CA, United States Duration: 2010 Jun 21 → 2010 Jun 24

Publication series

Name	Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010
Volume	2

Other

Other	Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010
Country/Territory	United States
City	Anaheim, CA
Period	10-06-21 → 10-06-24

All Science Journal Classification (ASJC) codes

Hardware and Architecture
Electrical and Electronic Engineering

Cite this

Yeh, H. M., & Chen, K. S. (2010). Development of device-level chemical-mechanical polishing simulation module using cellular automata method. In Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010 (pp. 669-672). (Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010; Vol. 2).

Yeh, Hsiu Ming ; Chen, Kuo Shen. / Development of device-level chemical-mechanical polishing simulation module using cellular automata method. Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010. 2010. pp. 669-672 (Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010).

@inproceedings{22948269e3204b1989ad3018f51d5366,

title = "Development of device-level chemical-mechanical polishing simulation module using cellular automata method",

abstract = "This work briefly presents the basic theory, the development, and a primary demonstration of a device-level chemical-Mechanical Polishing (CMP) CAD module. By integrating the phenomenological material removing relation such as Preston's equation, contact mechanics, finite element analysis, with a cellular automata environment, this CMP CAD aims to predict the rounding, dishing, and erosion effects commonly observed in modern copper CMP processes. Primary results indicate that this CAD can essentially catch the characteristics of polishing processes. Further modification of this CAD would enhance its accuracy for industrial applications.",

author = "Yeh, {Hsiu Ming} and Chen, {Kuo Shen}",

year = "2010",

language = "English",

isbn = "9781439834022",

series = "Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010",

pages = "669--672",

booktitle = "Nanotechnology 2010",

note = "Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010 ; Conference date: 21-06-2010 Through 24-06-2010",

}

Yeh, HM & Chen, KS 2010, Development of device-level chemical-mechanical polishing simulation module using cellular automata method. in Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010. Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010, vol. 2, pp. 669-672, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010, Anaheim, CA, United States, 10-06-21.

Development of device-level chemical-mechanical polishing simulation module using cellular automata method. / Yeh, Hsiu Ming; Chen, Kuo Shen.
Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010. 2010. p. 669-672 (Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Development of device-level chemical-mechanical polishing simulation module using cellular automata method

AU - Yeh, Hsiu Ming

AU - Chen, Kuo Shen

PY - 2010

Y1 - 2010

N2 - This work briefly presents the basic theory, the development, and a primary demonstration of a device-level chemical-Mechanical Polishing (CMP) CAD module. By integrating the phenomenological material removing relation such as Preston's equation, contact mechanics, finite element analysis, with a cellular automata environment, this CMP CAD aims to predict the rounding, dishing, and erosion effects commonly observed in modern copper CMP processes. Primary results indicate that this CAD can essentially catch the characteristics of polishing processes. Further modification of this CAD would enhance its accuracy for industrial applications.

AB - This work briefly presents the basic theory, the development, and a primary demonstration of a device-level chemical-Mechanical Polishing (CMP) CAD module. By integrating the phenomenological material removing relation such as Preston's equation, contact mechanics, finite element analysis, with a cellular automata environment, this CMP CAD aims to predict the rounding, dishing, and erosion effects commonly observed in modern copper CMP processes. Primary results indicate that this CAD can essentially catch the characteristics of polishing processes. Further modification of this CAD would enhance its accuracy for industrial applications.

UR - http://www.scopus.com/inward/record.url?scp=78049441667&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=78049441667&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:78049441667

SN - 9781439834022

T3 - Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010

SP - 669

EP - 672

BT - Nanotechnology 2010

T2 - Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010

Y2 - 21 June 2010 through 24 June 2010

ER -

Yeh HM, Chen KS. Development of device-level chemical-mechanical polishing simulation module using cellular automata method. In Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010. 2010. p. 669-672. (Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - Technical Proceedings of the 2010 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2010).

Development of device-level chemical-mechanical polishing simulation module using cellular automata method

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