Development of semi-analytical formulation for asymmetric warpage prediction in fan-out reconstitution process

K. S. Chen, Y. C. Lee, C. Y. Chen, T. Y. Chen, D. L. Chen, David Tarng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Asymmetric warping is an annoying phenomenon impacting the packaging reliability and must be reduced by modifying design and process parameters through proper prediction. Traditionally, highly meshed finite element simulations are usually used. However, its cost and case study nature make this approach less effective in early design phase. Instead, in this work, a semi-analytical formulation is presented for providing analytical prediction as a cost effective approach. The model proposed by Freund is served as the core to confirm the physical influence of key design variables and is further modified by considering the effects of material properties and structural geometry through finite element simulation to ensure the numerical accuracy. Finally, this formulation is numerically validated and shall be useful for adjusting layout, materials, and processing parameters, in packaging design.

Original languageEnglish
Title of host publication2021 International Conference on Electronics Packaging, ICEP 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages165-166
Number of pages2
ISBN (Electronic)9784991191114
DOIs
Publication statusPublished - 2021 May 12
Event20th International Conference on Electronics Packaging, ICEP 2021 - Tokyo, Japan
Duration: 2021 May 122021 May 14

Publication series

Name2021 International Conference on Electronics Packaging, ICEP 2021

Conference

Conference20th International Conference on Electronics Packaging, ICEP 2021
Country/TerritoryJapan
CityTokyo
Period21-05-1221-05-14

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Mechanics of Materials
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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