Development of SMA-actuated microgripper in micro assembly applications

Ren-Jung Chang, Y. C. Lin, C. C. Shiu, Y. T. Hsieh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

A micro assembly system with SMA-actuated microgripper for adhesive bonding is developed. With the design axioms in the processe of design, assembly, and manufacturing, a micro assembly system can be effectively realized to satisfy the requirements in assembly operations. In the micro assembly system, a polymer microgripper actuated by an arc-type SMA is designed and employed as an end effector. With the microgripper, a visual control system is integrated to provide the functions of gripping micro object, gluing adhesive, and operating adhesive bonding. In the performance test, a 20μm diameter metal wire is gripped, transported, glued, and assembled to a 380μm metal wire under visual control.

Original languageEnglish
Title of host publicationProceedings of the 33rd Annual Conference of the IEEE Industrial Electronics Society, IECON
Pages2886-2891
Number of pages6
DOIs
Publication statusPublished - 2007 Dec 1
Event33rd Annual Conference of the IEEE Industrial Electronics Society, IECON - Taipei, Taiwan
Duration: 2007 Nov 52007 Nov 8

Publication series

NameIECON Proceedings (Industrial Electronics Conference)

Other

Other33rd Annual Conference of the IEEE Industrial Electronics Society, IECON
CountryTaiwan
CityTaipei
Period07-11-0507-11-08

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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