DIC image on FIB ring-core analysis of depth sensing residual stress measurement of thin films

Wen Chieh Pan, Ang Ting Tsai, Fa Yen Cheng, Terry Yuan Fang Chen, Ming Tzer Lin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work demonstrates a technique to measure the residual stress of thin films that involves a combination of focused ion beam (FIB) milling, SEM imaging and digital image correlation (DIC) analysis. Use focused ion beam (FIB) to surface milling different depth of the ring core on thin film and capture the clear images with sub-micron resolution SEM. The residual stress measurement of 1.5 µm thick silver film through PVD Sputter and E-gun deposition was discussed. By the use of digital image correlation (DIC) for full-field strain analysis and calculate the displacement-strain relationship of the silver film surface and SEM high-resolution surface deformation images. The residual stress state of the two kinds of silver films was evaluated, which indicated that FIB-DIC was well implemented to measure the residual stress.

Original languageEnglish
Title of host publicationAdvancement of Optical Methods and DigitalImage Correlation in Experimental Mechanics - Proceedings of the 2018 Annual Conference on Experimentaland Applied Mechanics
EditorsMichael A. Sutton, Ming-Tzer Lin, Phillip L. Reu, Cosme Furlong, Luciano Lamberti, Cesar Sciammarella
PublisherSpringer New York LLC
Pages109-111
Number of pages3
ISBN (Print)9783319974804
DOIs
Publication statusPublished - 2019 Jan 1
EventSEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2018 - Greenville, United States
Duration: 2018 Jun 42018 Jun 7

Publication series

NameConference Proceedings of the Society for Experimental Mechanics Series
Volume12
ISSN (Print)2191-5644
ISSN (Electronic)2191-5652

Conference

ConferenceSEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2018
CountryUnited States
CityGreenville
Period18-06-0418-06-07

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Computational Mechanics
  • Mechanical Engineering

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