Diffusion behavior of Zn during reflow of Sn-9Zn solder on Ni/Cu substrate

Jagjiwan Mittal, Shih Ming Kuo, Yu Wei Lin, Kwang-Lung Lin

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Reflow behavior of Sn-Zn solder on Ni/Cu substrate was investigated in an infrared (IR) reflow furnace using different heating rates from 180 °C/min to 36 °C/min. Energy dispersive spectroscopy (EDX) studies of the reflowed samples showed increased diffusion of Zn from the solder to the intermetallic compound (IMC) layer with a decrease in heating rate. Higher interfacial activity and affinity of the Zn in the formation of the IMC with the lowering of the heating rate were further demonstrated by electron probe microanalyzer (EPMA) results. The Zn diffusion behavior was related to its higher reactivity and smaller size in comparison with Sn, phase separation during heating, and affinity of Zn to form Ni-Sn-Zn and Ni-Zn intermetallic compounds.

Original languageEnglish
Pages (from-to)2436-2442
Number of pages7
JournalJournal of Electronic Materials
Volume38
Issue number12
DOIs
Publication statusPublished - 2009 Dec 1

Fingerprint

solders
Heating rate
Soldering alloys
Intermetallics
intermetallics
heating
Energy dispersive spectroscopy
Infrared furnaces
Substrates
affinity
Phase separation
electron probes
furnaces
Heating
reactivity
Electrons
spectroscopy
energy

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Mittal, Jagjiwan ; Kuo, Shih Ming ; Lin, Yu Wei ; Lin, Kwang-Lung. / Diffusion behavior of Zn during reflow of Sn-9Zn solder on Ni/Cu substrate. In: Journal of Electronic Materials. 2009 ; Vol. 38, No. 12. pp. 2436-2442.
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Diffusion behavior of Zn during reflow of Sn-9Zn solder on Ni/Cu substrate. / Mittal, Jagjiwan; Kuo, Shih Ming; Lin, Yu Wei; Lin, Kwang-Lung.

In: Journal of Electronic Materials, Vol. 38, No. 12, 01.12.2009, p. 2436-2442.

Research output: Contribution to journalArticle

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AB - Reflow behavior of Sn-Zn solder on Ni/Cu substrate was investigated in an infrared (IR) reflow furnace using different heating rates from 180 °C/min to 36 °C/min. Energy dispersive spectroscopy (EDX) studies of the reflowed samples showed increased diffusion of Zn from the solder to the intermetallic compound (IMC) layer with a decrease in heating rate. Higher interfacial activity and affinity of the Zn in the formation of the IMC with the lowering of the heating rate were further demonstrated by electron probe microanalyzer (EPMA) results. The Zn diffusion behavior was related to its higher reactivity and smaller size in comparison with Sn, phase separation during heating, and affinity of Zn to form Ni-Sn-Zn and Ni-Zn intermetallic compounds.

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