Diffusion of Cu and interfacial reactions during reflow of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga alloy on Ni/Cu substrate

Jagjiwan Mittal, Kwang-Lung Lin

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

Reflow behavior of a Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga (five-element) solder on the Ni/Cu substrate was investigated under different heating rates. Reflowed samples show decreased Zn and increased AgZn3 in the solder with a reduction in the heating rate. The Zn at the solder/substrate interface was found to be much lower than that in the Sn-Zn solder systems. Cu was observed to be diffused through the electroplated Ni layer and noticed only with the Ag-Zn compound in the solder. Ga was spotted at the interface in the Ag-Zn matrix, whereas Al was detected with the Zn at the interface. Small intermetallic compound (IMC) layer was formed at the interface; however, its amount enhanced with the reduction in the heating rate. Present study relates the reflow behavior of the five-element solder with the reactivity of different elements in the system and its influence on the formation of IMCs in the solder and at the solder/substrate interface.

Original languageEnglish
Pages (from-to)1142-1148
Number of pages7
JournalJournal of Materials Research
Volume27
Issue number8
DOIs
Publication statusPublished - 2012 Apr 28

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanical Engineering
  • Mechanics of Materials
  • Condensed Matter Physics

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