Direct bonding of recessed-structure SAW filter on silicon substrate

Shin Hung Tsai, Na Fu Wang, Jui Hong Horng, Mau Phon Houng, Yeong Her Wang

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


A procedure for fabricating a recessed surface acoustic wave (SAW) device coupled with silicon substrate is reported. The recessed structure is stable and rugged enough against the bonding process, and it can be applied to integrate a semiconductor device into one chip by a direct bonding technique. In this paper, the tensile strength of silicon (Si)-to-recessed-SAW filter is measured, and the performance of the device is discussed.

Original languageEnglish
Pages (from-to)913-916
Number of pages4
JournalIEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
Issue number7
Publication statusPublished - 2004 Jul

All Science Journal Classification (ASJC) codes

  • Instrumentation
  • Acoustics and Ultrasonics
  • Electrical and Electronic Engineering


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