Direct bonding of recessed-structure SAW filter on silicon substrate

Shin Hung Tsai, Na Fu Wang, Jui Hong Horng, Mau-phon Houng, Yeong-Her Wang

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

A procedure for fabricating a recessed surface acoustic wave (SAW) device coupled with silicon substrate is reported. The recessed structure is stable and rugged enough against the bonding process, and it can be applied to integrate a semiconductor device into one chip by a direct bonding technique. In this paper, the tensile strength of silicon (Si)-to-recessed-SAW filter is measured, and the performance of the device is discussed.

Original languageEnglish
Pages (from-to)913-916
Number of pages4
JournalIEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control
Volume51
Issue number7
DOIs
Publication statusPublished - 2004 Jul 1

Fingerprint

Acoustic surface wave filters
filters
Acoustic surface wave devices
Silicon
surface acoustic wave devices
acoustics
silicon
Substrates
Semiconductor devices
semiconductor devices
tensile strength
Tensile strength
chips

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Acoustics and Ultrasonics

Cite this

@article{8626e2197c024b438a6b9321ec4173ff,
title = "Direct bonding of recessed-structure SAW filter on silicon substrate",
abstract = "A procedure for fabricating a recessed surface acoustic wave (SAW) device coupled with silicon substrate is reported. The recessed structure is stable and rugged enough against the bonding process, and it can be applied to integrate a semiconductor device into one chip by a direct bonding technique. In this paper, the tensile strength of silicon (Si)-to-recessed-SAW filter is measured, and the performance of the device is discussed.",
author = "Tsai, {Shin Hung} and Wang, {Na Fu} and Horng, {Jui Hong} and Mau-phon Houng and Yeong-Her Wang",
year = "2004",
month = "7",
day = "1",
doi = "10.1109/TUFFC.2004.1320752",
language = "English",
volume = "51",
pages = "913--916",
journal = "IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control",
issn = "0885-3010",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "7",

}

Direct bonding of recessed-structure SAW filter on silicon substrate. / Tsai, Shin Hung; Wang, Na Fu; Horng, Jui Hong; Houng, Mau-phon; Wang, Yeong-Her.

In: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, Vol. 51, No. 7, 01.07.2004, p. 913-916.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Direct bonding of recessed-structure SAW filter on silicon substrate

AU - Tsai, Shin Hung

AU - Wang, Na Fu

AU - Horng, Jui Hong

AU - Houng, Mau-phon

AU - Wang, Yeong-Her

PY - 2004/7/1

Y1 - 2004/7/1

N2 - A procedure for fabricating a recessed surface acoustic wave (SAW) device coupled with silicon substrate is reported. The recessed structure is stable and rugged enough against the bonding process, and it can be applied to integrate a semiconductor device into one chip by a direct bonding technique. In this paper, the tensile strength of silicon (Si)-to-recessed-SAW filter is measured, and the performance of the device is discussed.

AB - A procedure for fabricating a recessed surface acoustic wave (SAW) device coupled with silicon substrate is reported. The recessed structure is stable and rugged enough against the bonding process, and it can be applied to integrate a semiconductor device into one chip by a direct bonding technique. In this paper, the tensile strength of silicon (Si)-to-recessed-SAW filter is measured, and the performance of the device is discussed.

UR - http://www.scopus.com/inward/record.url?scp=3142696860&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=3142696860&partnerID=8YFLogxK

U2 - 10.1109/TUFFC.2004.1320752

DO - 10.1109/TUFFC.2004.1320752

M3 - Article

VL - 51

SP - 913

EP - 916

JO - IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

JF - IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control

SN - 0885-3010

IS - 7

ER -