Directly patterning metal films by nanoimprint lithography with low-temperature and low-pressure

H. L. Chen; S. Y. Chuang; H. C. Cheng; C. H. Lin; T. C. Chu

doi:10.1016/j.mee.2006.01.095

Directly patterning metal films by nanoimprint lithography with low-temperature and low-pressure

H. L. Chen, S. Y. Chuang, H. C. Cheng, C. H. Lin, T. C. Chu

Department of Photonics

Research output: Contribution to journal › Article › peer-review

66 Citations (Scopus)

Abstract

We demonstrated a new imprint method named nanoimprinting in metal/polymer bi-layer structures (NIMB) for patterning metal films with varied profiles. Converse with conventional nanoimprint lithography, the patterned mold is directly imprint in metal films not in polymer based resists. In general, direct imprint in metal films need ultra-high pressure or temperature to form patterns. In this paper, we improve the direct imprint processes by using a sharp mold and an underlying soft pad layer for the reduction of the imprint pressure and temperature. The imprint pressure can be reduced to be compatible with the conventional nanoimprint instrument. For the direct contact the metal film with mold, no surfactant should be coated on the surface of mold. It also indicates no mold-rework-processes are necessary for this direct imprint method.

Original language	English
Pages (from-to)	893-896
Number of pages	4
Journal	Microelectronic Engineering
Volume	83
Issue number	4-9 SPEC. ISS.
DOIs	https://doi.org/10.1016/j.mee.2006.01.095
Publication status	Published - 2006 Apr

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Condensed Matter Physics
Surfaces, Coatings and Films
Electrical and Electronic Engineering

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10.1016/j.mee.2006.01.095

Cite this

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title = "Directly patterning metal films by nanoimprint lithography with low-temperature and low-pressure",

abstract = "We demonstrated a new imprint method named nanoimprinting in metal/polymer bi-layer structures (NIMB) for patterning metal films with varied profiles. Converse with conventional nanoimprint lithography, the patterned mold is directly imprint in metal films not in polymer based resists. In general, direct imprint in metal films need ultra-high pressure or temperature to form patterns. In this paper, we improve the direct imprint processes by using a sharp mold and an underlying soft pad layer for the reduction of the imprint pressure and temperature. The imprint pressure can be reduced to be compatible with the conventional nanoimprint instrument. For the direct contact the metal film with mold, no surfactant should be coated on the surface of mold. It also indicates no mold-rework-processes are necessary for this direct imprint method.",

author = "Chen, {H. L.} and Chuang, {S. Y.} and Cheng, {H. C.} and Lin, {C. H.} and Chu, {T. C.}",

note = "Funding Information: The authors are very thankful to the National Science Council, Taiwan, ROC for supporting this study under project NSC94-2215-E-002-026.",

year = "2006",

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doi = "10.1016/j.mee.2006.01.095",

language = "English",

volume = "83",

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journal = "Microelectronic Engineering",

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T1 - Directly patterning metal films by nanoimprint lithography with low-temperature and low-pressure

AU - Chen, H. L.

AU - Chuang, S. Y.

AU - Cheng, H. C.

AU - Lin, C. H.

AU - Chu, T. C.

N1 - Funding Information: The authors are very thankful to the National Science Council, Taiwan, ROC for supporting this study under project NSC94-2215-E-002-026.

PY - 2006/4

Y1 - 2006/4

N2 - We demonstrated a new imprint method named nanoimprinting in metal/polymer bi-layer structures (NIMB) for patterning metal films with varied profiles. Converse with conventional nanoimprint lithography, the patterned mold is directly imprint in metal films not in polymer based resists. In general, direct imprint in metal films need ultra-high pressure or temperature to form patterns. In this paper, we improve the direct imprint processes by using a sharp mold and an underlying soft pad layer for the reduction of the imprint pressure and temperature. The imprint pressure can be reduced to be compatible with the conventional nanoimprint instrument. For the direct contact the metal film with mold, no surfactant should be coated on the surface of mold. It also indicates no mold-rework-processes are necessary for this direct imprint method.

AB - We demonstrated a new imprint method named nanoimprinting in metal/polymer bi-layer structures (NIMB) for patterning metal films with varied profiles. Converse with conventional nanoimprint lithography, the patterned mold is directly imprint in metal films not in polymer based resists. In general, direct imprint in metal films need ultra-high pressure or temperature to form patterns. In this paper, we improve the direct imprint processes by using a sharp mold and an underlying soft pad layer for the reduction of the imprint pressure and temperature. The imprint pressure can be reduced to be compatible with the conventional nanoimprint instrument. For the direct contact the metal film with mold, no surfactant should be coated on the surface of mold. It also indicates no mold-rework-processes are necessary for this direct imprint method.

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IS - 4-9 SPEC. ISS.

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Directly patterning metal films by nanoimprint lithography with low-temperature and low-pressure

Abstract

All Science Journal Classification (ASJC) codes

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