Dissolution behavior of Cu and Ag substrates in molten solders

Po Yi Yeh; Jenn Ming Song; Kwang Lung Lin

doi:10.1007/BF02692557

Dissolution behavior of Cu and Ag substrates in molten solders

Po Yi Yeh, Jenn Ming Song, Kwang Lung Lin

Research output: Contribution to journal › Article › peer-review

31 Citations (Scopus)

Abstract

This study investigated the dissolution behavior of Cu and Ag substrates in molten Sn, Sn-3.5Ag, Sn-4.0Ag-0.5Cu, Sn-8.6Zn and Sn-8.55Zn-0.5Ag-0.1Al-0.SGa lead-free solders as well as in Sn-37Pb solder for comparison at 300, 350, and 400°C. Results show that Sn-Zn alloys have a substantially lower dissolution rate of both Cu and Ag substrates than the other solders. Differences in interfacial intermetallic compounds formed during reaction and the morphology of these compounds strongly affected the substrate dissolution behavior. Soldering temperature and the corresponding solubility limit of the substrate elements in the liquid solder also played important roles in the interfacial morphology and dissolution rate of substrate.

Original language	English
Pages (from-to)	978-987
Number of pages	10
Journal	Journal of Electronic Materials
Volume	35
Issue number	5
DOIs	https://doi.org/10.1007/BF02692557
Publication status	Published - 2006 May

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/BF02692557

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title = "Dissolution behavior of Cu and Ag substrates in molten solders",

abstract = "This study investigated the dissolution behavior of Cu and Ag substrates in molten Sn, Sn-3.5Ag, Sn-4.0Ag-0.5Cu, Sn-8.6Zn and Sn-8.55Zn-0.5Ag-0.1Al-0.SGa lead-free solders as well as in Sn-37Pb solder for comparison at 300, 350, and 400°C. Results show that Sn-Zn alloys have a substantially lower dissolution rate of both Cu and Ag substrates than the other solders. Differences in interfacial intermetallic compounds formed during reaction and the morphology of these compounds strongly affected the substrate dissolution behavior. Soldering temperature and the corresponding solubility limit of the substrate elements in the liquid solder also played important roles in the interfacial morphology and dissolution rate of substrate.",

author = "Yeh, {Po Yi} and Song, {Jenn Ming} and Lin, {Kwang Lung}",

note = "Funding Information: Financial support of this work from National Science Council of Republic of China under NSC-93-2216-E-006-011 is gratefully acknowledged.",

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doi = "10.1007/BF02692557",

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volume = "35",

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journal = "Journal of Electronic Materials",

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T1 - Dissolution behavior of Cu and Ag substrates in molten solders

AU - Yeh, Po Yi

AU - Song, Jenn Ming

AU - Lin, Kwang Lung

N1 - Funding Information: Financial support of this work from National Science Council of Republic of China under NSC-93-2216-E-006-011 is gratefully acknowledged.

PY - 2006/5

Y1 - 2006/5

N2 - This study investigated the dissolution behavior of Cu and Ag substrates in molten Sn, Sn-3.5Ag, Sn-4.0Ag-0.5Cu, Sn-8.6Zn and Sn-8.55Zn-0.5Ag-0.1Al-0.SGa lead-free solders as well as in Sn-37Pb solder for comparison at 300, 350, and 400°C. Results show that Sn-Zn alloys have a substantially lower dissolution rate of both Cu and Ag substrates than the other solders. Differences in interfacial intermetallic compounds formed during reaction and the morphology of these compounds strongly affected the substrate dissolution behavior. Soldering temperature and the corresponding solubility limit of the substrate elements in the liquid solder also played important roles in the interfacial morphology and dissolution rate of substrate.

AB - This study investigated the dissolution behavior of Cu and Ag substrates in molten Sn, Sn-3.5Ag, Sn-4.0Ag-0.5Cu, Sn-8.6Zn and Sn-8.55Zn-0.5Ag-0.1Al-0.SGa lead-free solders as well as in Sn-37Pb solder for comparison at 300, 350, and 400°C. Results show that Sn-Zn alloys have a substantially lower dissolution rate of both Cu and Ag substrates than the other solders. Differences in interfacial intermetallic compounds formed during reaction and the morphology of these compounds strongly affected the substrate dissolution behavior. Soldering temperature and the corresponding solubility limit of the substrate elements in the liquid solder also played important roles in the interfacial morphology and dissolution rate of substrate.

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Dissolution behavior of Cu and Ag substrates in molten solders

Abstract

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