Dissolution behavior of Cu and Ag substrates in molten solders

Po Yi Yeh, Jenn Ming Song, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

31 Citations (Scopus)

Abstract

This study investigated the dissolution behavior of Cu and Ag substrates in molten Sn, Sn-3.5Ag, Sn-4.0Ag-0.5Cu, Sn-8.6Zn and Sn-8.55Zn-0.5Ag-0.1Al-0.SGa lead-free solders as well as in Sn-37Pb solder for comparison at 300, 350, and 400°C. Results show that Sn-Zn alloys have a substantially lower dissolution rate of both Cu and Ag substrates than the other solders. Differences in interfacial intermetallic compounds formed during reaction and the morphology of these compounds strongly affected the substrate dissolution behavior. Soldering temperature and the corresponding solubility limit of the substrate elements in the liquid solder also played important roles in the interfacial morphology and dissolution rate of substrate.

Original languageEnglish
Pages (from-to)978-987
Number of pages10
JournalJournal of Electronic Materials
Volume35
Issue number5
DOIs
Publication statusPublished - 2006 May 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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