Dissolution of Sn in a SnPb solder bump under current stressing

Ying Ta Chiu, Kwang Lung Lin, Yi Shao Lai

Research output: Contribution to journalArticlepeer-review

21 Citations (Scopus)

Abstract

An in situ SEMenergy dispersive spectroscopy (EDS) analysis revealed that the dispersed Sn-rich phase of the 95Pb-5Sn solder in a 95Pb-5Sn63Sn-37Pb composite solder bump dissolved under current stressing. The dissolution was not prominent until the current density reached a threshold value of between 3.3 × 10 4 and 4.2 × 10 4 Acm 2. Supersaturation over thermal solubility of Sn-in-Pb was detected with current stressing. A polarity dissolution model was proposed for the dissolution behavior of the Sn-rich phase under current stressing. The dissolution mechanism under current stressing was discussed in relation to electromigration and thermomigration behavior of SnPb solders.

Original languageEnglish
Article number043517
JournalJournal of Applied Physics
Volume111
Issue number4
DOIs
Publication statusPublished - 2012 Feb 15

All Science Journal Classification (ASJC) codes

  • General Physics and Astronomy

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