Abstract
An in situ SEMenergy dispersive spectroscopy (EDS) analysis revealed that the dispersed Sn-rich phase of the 95Pb-5Sn solder in a 95Pb-5Sn63Sn-37Pb composite solder bump dissolved under current stressing. The dissolution was not prominent until the current density reached a threshold value of between 3.3 × 10 4 and 4.2 × 10 4 Acm 2. Supersaturation over thermal solubility of Sn-in-Pb was detected with current stressing. A polarity dissolution model was proposed for the dissolution behavior of the Sn-rich phase under current stressing. The dissolution mechanism under current stressing was discussed in relation to electromigration and thermomigration behavior of SnPb solders.
Original language | English |
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Article number | 043517 |
Journal | Journal of Applied Physics |
Volume | 111 |
Issue number | 4 |
DOIs | |
Publication status | Published - 2012 Feb 15 |
All Science Journal Classification (ASJC) codes
- General Physics and Astronomy