This paper reports a new composite thin film of Pt-DLC for used as a microelectrode for electrochemical analysis. An RF sputter deposition technique was used for the preparation of these thin films under various ratios of Ar/CH4. The microstructure of as-deposited thin films was characterized using transmission electron microscopy and Raman spectroscopy, the composition using electron probe microanalysis, the surface morphology using scanning electron microscopy, and the sheet resistance using a four-point probe. Correlation among the growth parameters, film composition, and structure are presented. Both the composition and Raman characteristics were found to be strong functions of the deposition rate. Improved electrical conductivity and reduced film stress were also found due to the addition of platinum into DLC.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Mechanical Engineering
- Materials Chemistry
- Electrical and Electronic Engineering