Dry etch challenges of 0.25 μm dual damascene structures

R. F. Schnabel, D. Dobuzinski, F. Wang, D. C. Perng, J. Gambino, H. Palm

Research output: Contribution to journalArticle

2 Citations (Scopus)
Original languageEnglish
Pages (from-to)102-104
Number of pages3
JournalVide: Science, Technique et Applications
Volume53
Issue number283 SUPPL.
Publication statusPublished - 1997 Dec 1

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films

Cite this

Schnabel, R. F., Dobuzinski, D., Wang, F., Perng, D. C., Gambino, J., & Palm, H. (1997). Dry etch challenges of 0.25 μm dual damascene structures. Vide: Science, Technique et Applications, 53(283 SUPPL.), 102-104.