Dry etch challenges of 0.25 μm dual damascene structures

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	102-104
Number of pages	3
Journal	Vide: Science, Technique et Applications
Volume	53
Issue number	283 SUPPL.
Publication status	Published - 1997

All Science Journal Classification (ASJC) codes

@article{b0a2db4881cf4357acd95b032be08e60,

title = "Dry etch challenges of 0.25 μm dual damascene structures",

author = "Schnabel, \{R. F.\} and D. Dobuzinski and F. Wang and Perng, \{D. C.\} and J. Gambino and H. Palm",

year = "1997",

language = "English",

volume = "53",

pages = "102--104",

journal = "Vide: Science, Technique et Applications",

issn = "1266-0167",

publisher = "Societe Francaise du Vide",

number = "283 SUPPL.",

}

TY - JOUR

T1 - Dry etch challenges of 0.25 μm dual damascene structures

AU - Schnabel, R. F.

AU - Dobuzinski, D.

AU - Wang, F.

AU - Perng, D. C.

AU - Gambino, J.

AU - Palm, H.

PY - 1997

Y1 - 1997

UR - https://www.scopus.com/pages/publications/20544464209

UR - https://www.scopus.com/pages/publications/20544464209#tab=citedBy

M3 - Article

AN - SCOPUS:20544464209

SN - 1266-0167

VL - 53

SP - 102

EP - 104

JO - Vide: Science, Technique et Applications

JF - Vide: Science, Technique et Applications

IS - 283 SUPPL.

ER -