Dual metallic pattern transfer based on metal-film contact imprinting lithography

Chun Hung Chen, Yung Chun Lee

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


This paper reports a novel pattern transfer method which can transfer two patterned metal films from one single mold to two separate polymer substrates. The first metallic film is defined by the top convex surface of a silicon mold and is transferred to a polymer substrate directly from roller-assisted contact printing and infrared heating. The second metallic film, which is defined by the bottom concave surface of the same silicon mold, is transferred to another polymer substrate through the mechanism of UV imprinting and curing processes. This new method not only can most efficiently utilize the metal films deposited on a mold but also can save the effort in mold cleaning for reusing the mold for continuous printing processes. Furthermore, since the two metallic patterns are highly complementary to each other all over the entire patterned area, new and important applications can be applied. A number of experiments have been carried out, and the feasibility of this new lithography approach is confirmed.

Original languageEnglish
Article number5672386
Pages (from-to)37-41
Number of pages5
JournalJournal of Microelectromechanical Systems
Issue number1
Publication statusPublished - 2011 Feb

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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