Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate

Chang Ho Yu, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

25 Citations (Scopus)

Abstract

The soldering reaction and interfacial microstructure formed between liquid Sn-Zn-Ag solder and Cu at the early stage of soldering at 250 °C for 15 s were studied primarily with the aid of transmission electron microscope (TEM). To achieve the early stage reaction information, the soldered specimens, 5 mm × 5 mm × 500 μm solder on 10 mm × 10 mm × 20 μm Cu, were rapidly quenched in liquid nitrogen after soldering. The results of TEM interfacial analysis show that a Cu-Zn reaction zone, consisting of β′-CuZn and γ-Cu5Zn8, formed near Cu while a Ag-Zn zone, consisting of γ-Ag5Zn8 and ∈-AgZn3, formed near solder. The innermost layer adjacent to the Cu substrate is an amorphous Cu-Zn diffusion region that contains dispersed β′-CuZn nanocrystalline cells. The β′-CuZn also precipitates in the γ-Ag5Zn8 and ∈-AgZn3 layer due to the supersaturation of Cu.

Original languageEnglish
Pages (from-to)1242-1249
Number of pages8
JournalJournal of Materials Research
Volume20
Issue number5
DOIs
Publication statusPublished - 2005 May

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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