Effect of Accelerating Voltage and Specimen Thickness on Spatial Resolutions of t-EBSD in Copper

Z.W. Shia, C.W. Kuo, T.Y. Kuo, Jui-Chao Kuo

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationInternational Conference & Exhibition on Advanced & Nano Materials (ICANM)
Place of PublicationMontreal, Quebec, Canada
Publication statusPublished - 2016 Aug 1

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