Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders

R. S. Lai, Kwang-Lung Lin, B. Salam

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Purpose - To study the effect of Ag content on the melting temperature and wetting properties of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free Solders. Design/methodology/approach - The solder alloys used in the experiment were Sn-8.5Zn-xAg-0.01Al-0.1Ga (x=0, 0.1, 0.3, 0.5, 1 and 1.5). In this study, the alloys were initially studied using differential scanning calorimetry to determine their melting temperatures. Afterward, the solderability of the solders was studied using wetting balance and contact angle methods. Moreover, the microstructures of the solders were also investigated with an optical microscope, scanning electron microscope, energy dispersive X-ray, X-ray diffraction and electron probe micro analysis. Findings - A small increase in Ag content in the Sn-8.5Zn-xAg-0.01Al-0.1Ga solders, from 0.1 to 1.0 wt%, has been found to lower their solidus temperature from 198.05°C to 190.20°C. A Ag content of 1.5 wt% increased the solidus temperature of the studied solder systems to 197.79°C. Furthermore, the study also found that the addition of silver lowered the wetting forces of the studied solders. The formation of multi-intermetallic layers of Cu-Zn and Ag-Zn at the interface between the studied solders and copper might explain the reduction of the wetting forces. Research limitations/implications - The silver contents in the studied Sn-8.5Zn-xAg-0.01Al-0.1Ga solders were limited to 0, 0.1, 0.3, 0.5, 1.0 and 1.5 wt%. Practical implications - Useful literature for solder alloy designers and SMT engineers. Originality/value - The paper provides the answers to the research question of what is the effect of silver content on the melting temperature and wetting properties of Sn-8.5Zn-xAg-0.01Al-0.1Ga solders.

Original languageEnglish
Pages (from-to)22-26
Number of pages5
JournalSoldering and Surface Mount Technology
Volume20
Issue number1
DOIs
Publication statusPublished - 2008

Fingerprint

solidus
solders
Soldering alloys
wetting
Wetting
Temperature
temperature
Silver
Melting point
silver
melting
Lead-free solders
Surface mount technology
scanning
Electron probe microanalysis
electron probes
optical microscopes
microanalysis
Contact angle
Intermetallics

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Materials Science(all)
  • Metals and Alloys

Cite this

@article{8fa5c7b4084a45139de0c8ee566ca049,
title = "Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders",
abstract = "Purpose - To study the effect of Ag content on the melting temperature and wetting properties of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free Solders. Design/methodology/approach - The solder alloys used in the experiment were Sn-8.5Zn-xAg-0.01Al-0.1Ga (x=0, 0.1, 0.3, 0.5, 1 and 1.5). In this study, the alloys were initially studied using differential scanning calorimetry to determine their melting temperatures. Afterward, the solderability of the solders was studied using wetting balance and contact angle methods. Moreover, the microstructures of the solders were also investigated with an optical microscope, scanning electron microscope, energy dispersive X-ray, X-ray diffraction and electron probe micro analysis. Findings - A small increase in Ag content in the Sn-8.5Zn-xAg-0.01Al-0.1Ga solders, from 0.1 to 1.0 wt{\%}, has been found to lower their solidus temperature from 198.05°C to 190.20°C. A Ag content of 1.5 wt{\%} increased the solidus temperature of the studied solder systems to 197.79°C. Furthermore, the study also found that the addition of silver lowered the wetting forces of the studied solders. The formation of multi-intermetallic layers of Cu-Zn and Ag-Zn at the interface between the studied solders and copper might explain the reduction of the wetting forces. Research limitations/implications - The silver contents in the studied Sn-8.5Zn-xAg-0.01Al-0.1Ga solders were limited to 0, 0.1, 0.3, 0.5, 1.0 and 1.5 wt{\%}. Practical implications - Useful literature for solder alloy designers and SMT engineers. Originality/value - The paper provides the answers to the research question of what is the effect of silver content on the melting temperature and wetting properties of Sn-8.5Zn-xAg-0.01Al-0.1Ga solders.",
author = "Lai, {R. S.} and Kwang-Lung Lin and B. Salam",
year = "2008",
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Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders. / Lai, R. S.; Lin, Kwang-Lung; Salam, B.

In: Soldering and Surface Mount Technology, Vol. 20, No. 1, 2008, p. 22-26.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders

AU - Lai, R. S.

AU - Lin, Kwang-Lung

AU - Salam, B.

PY - 2008

Y1 - 2008

N2 - Purpose - To study the effect of Ag content on the melting temperature and wetting properties of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free Solders. Design/methodology/approach - The solder alloys used in the experiment were Sn-8.5Zn-xAg-0.01Al-0.1Ga (x=0, 0.1, 0.3, 0.5, 1 and 1.5). In this study, the alloys were initially studied using differential scanning calorimetry to determine their melting temperatures. Afterward, the solderability of the solders was studied using wetting balance and contact angle methods. Moreover, the microstructures of the solders were also investigated with an optical microscope, scanning electron microscope, energy dispersive X-ray, X-ray diffraction and electron probe micro analysis. Findings - A small increase in Ag content in the Sn-8.5Zn-xAg-0.01Al-0.1Ga solders, from 0.1 to 1.0 wt%, has been found to lower their solidus temperature from 198.05°C to 190.20°C. A Ag content of 1.5 wt% increased the solidus temperature of the studied solder systems to 197.79°C. Furthermore, the study also found that the addition of silver lowered the wetting forces of the studied solders. The formation of multi-intermetallic layers of Cu-Zn and Ag-Zn at the interface between the studied solders and copper might explain the reduction of the wetting forces. Research limitations/implications - The silver contents in the studied Sn-8.5Zn-xAg-0.01Al-0.1Ga solders were limited to 0, 0.1, 0.3, 0.5, 1.0 and 1.5 wt%. Practical implications - Useful literature for solder alloy designers and SMT engineers. Originality/value - The paper provides the answers to the research question of what is the effect of silver content on the melting temperature and wetting properties of Sn-8.5Zn-xAg-0.01Al-0.1Ga solders.

AB - Purpose - To study the effect of Ag content on the melting temperature and wetting properties of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free Solders. Design/methodology/approach - The solder alloys used in the experiment were Sn-8.5Zn-xAg-0.01Al-0.1Ga (x=0, 0.1, 0.3, 0.5, 1 and 1.5). In this study, the alloys were initially studied using differential scanning calorimetry to determine their melting temperatures. Afterward, the solderability of the solders was studied using wetting balance and contact angle methods. Moreover, the microstructures of the solders were also investigated with an optical microscope, scanning electron microscope, energy dispersive X-ray, X-ray diffraction and electron probe micro analysis. Findings - A small increase in Ag content in the Sn-8.5Zn-xAg-0.01Al-0.1Ga solders, from 0.1 to 1.0 wt%, has been found to lower their solidus temperature from 198.05°C to 190.20°C. A Ag content of 1.5 wt% increased the solidus temperature of the studied solder systems to 197.79°C. Furthermore, the study also found that the addition of silver lowered the wetting forces of the studied solders. The formation of multi-intermetallic layers of Cu-Zn and Ag-Zn at the interface between the studied solders and copper might explain the reduction of the wetting forces. Research limitations/implications - The silver contents in the studied Sn-8.5Zn-xAg-0.01Al-0.1Ga solders were limited to 0, 0.1, 0.3, 0.5, 1.0 and 1.5 wt%. Practical implications - Useful literature for solder alloy designers and SMT engineers. Originality/value - The paper provides the answers to the research question of what is the effect of silver content on the melting temperature and wetting properties of Sn-8.5Zn-xAg-0.01Al-0.1Ga solders.

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