Effect of chemical aging on warpage for encapsulated packages - Characterization and simulation

Tz Cheng Chiu, Hong Wei Huang, Yi Shao Lai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

The effect of curing process on the warpage of encapsulated electronic package is considered by using a coupled chemical-thermo-mechanical modeling methodology. A cure-dependent constitutive model that consists of a cure kinetics model, a curing and chemical aging induced shrinkage model and a degree of cure-dependent viscoelastic relaxation model was implemented in a numerical finite element model for warpage simulation. Effects of polymerization conversion and chemical aging on the warpage evolution of a bimaterial dummy package after molding and during the post-mold curing (PMC) process were investigated by using the proposed modeling methodology. Shadow Moiré warpage analyses were also performed to validate the numerical results. It was found from the warpage analyses that the chemical aging, while contributing little to the overall crosslinking during PMC, has a significant effect on package warpage. The coupled chemical-thermo-mechanical model can be applied for performing numerical optimization for packaging process and assembly reliability.

Original languageEnglish
Title of host publication2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages1894-1900
Number of pages7
DOIs
Publication statusPublished - 2011 Jul 21
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
Duration: 2011 May 312011 Jun 3

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2011 61st Electronic Components and Technology Conference, ECTC 2011
CountryUnited States
CityLake Buena Vista, FL
Period11-05-3111-06-03

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Chiu, T. C., Huang, H. W., & Lai, Y. S. (2011). Effect of chemical aging on warpage for encapsulated packages - Characterization and simulation. In 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011 (pp. 1894-1900). [5898774] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2011.5898774