TY - GEN
T1 - Effect of chemical aging on warpage for encapsulated packages - Characterization and simulation
AU - Chiu, Tz Cheng
AU - Huang, Hong Wei
AU - Lai, Yi Shao
PY - 2011
Y1 - 2011
N2 - The effect of curing process on the warpage of encapsulated electronic package is considered by using a coupled chemical-thermo-mechanical modeling methodology. A cure-dependent constitutive model that consists of a cure kinetics model, a curing and chemical aging induced shrinkage model and a degree of cure-dependent viscoelastic relaxation model was implemented in a numerical finite element model for warpage simulation. Effects of polymerization conversion and chemical aging on the warpage evolution of a bimaterial dummy package after molding and during the post-mold curing (PMC) process were investigated by using the proposed modeling methodology. Shadow Moiré warpage analyses were also performed to validate the numerical results. It was found from the warpage analyses that the chemical aging, while contributing little to the overall crosslinking during PMC, has a significant effect on package warpage. The coupled chemical-thermo-mechanical model can be applied for performing numerical optimization for packaging process and assembly reliability.
AB - The effect of curing process on the warpage of encapsulated electronic package is considered by using a coupled chemical-thermo-mechanical modeling methodology. A cure-dependent constitutive model that consists of a cure kinetics model, a curing and chemical aging induced shrinkage model and a degree of cure-dependent viscoelastic relaxation model was implemented in a numerical finite element model for warpage simulation. Effects of polymerization conversion and chemical aging on the warpage evolution of a bimaterial dummy package after molding and during the post-mold curing (PMC) process were investigated by using the proposed modeling methodology. Shadow Moiré warpage analyses were also performed to validate the numerical results. It was found from the warpage analyses that the chemical aging, while contributing little to the overall crosslinking during PMC, has a significant effect on package warpage. The coupled chemical-thermo-mechanical model can be applied for performing numerical optimization for packaging process and assembly reliability.
UR - https://www.scopus.com/pages/publications/79960410036
UR - https://www.scopus.com/pages/publications/79960410036#tab=citedBy
U2 - 10.1109/ECTC.2011.5898774
DO - 10.1109/ECTC.2011.5898774
M3 - Conference contribution
AN - SCOPUS:79960410036
SN - 9781612844978
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1894
EP - 1900
BT - 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
T2 - 2011 61st Electronic Components and Technology Conference, ECTC 2011
Y2 - 31 May 2011 through 3 June 2011
ER -