Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder

Hwa Teng Lee; Yin Fa Chen; Ting Fu Hong; Ku Ta Shih

doi:10.1109/EPTC.2009.5416420

Effect of cooling rate on Ag₃Sn formation in Sn-Ag based lead-free solder

Hwa Teng Lee, Yin Fa Chen, Ting Fu Hong, Ku Ta Shih

Department of Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

12 Citations (Scopus)

Abstract

Effect of solidification cooling rate on Ag₃Sn formation and its morphological appearance in Sn-Ag based lead-free solder was investigated. Depends on cooling rate, three types of Ag₃Sn compound with different morphologies may form by solidification. They are particle-like, needle-like, and platelike respectively. Small particle-like Ag3Sn in large amount was occurred by rapid cooling, where plate liked Ag₃Sn was formed by slow cooling condition. Extremely slow cooling such as furnace cooling results large plate-like or pillar-like Ag₃Sn to form, particularly in solder matrix adjacent to the solder/Cu interface. The enrichment of Sn in Cu ₆Sn₅ IMC layer formation at interface causes Sn depletion at the adjacent area near the interface. As a result, Ag atoms were enriched relatively which favored formation and growth of primary Ag3Sn in liquid phase.

Original language	English
Title of host publication	EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages	875-878
Number of pages	4
DOIs	https://doi.org/10.1109/EPTC.2009.5416420
Publication status	Published - 2009
Event	2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore Duration: 2009 Dec 9 → 2009 Dec 11

Publication series

Name	Proceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other	2009 11th Electronic Packaging Technology Conference, EPTC 2009
Country/Territory	Singapore
City	Singapore
Period	09-12-09 → 09-12-11

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Condensed Matter Physics

Access to Document

10.1109/EPTC.2009.5416420

Cite this

@inproceedings{abcf5a9e9c5e4a80b2febec615e36229,

title = "Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder",

abstract = "Effect of solidification cooling rate on Ag3Sn formation and its morphological appearance in Sn-Ag based lead-free solder was investigated. Depends on cooling rate, three types of Ag3Sn compound with different morphologies may form by solidification. They are particle-like, needle-like, and platelike respectively. Small particle-like Ag3Sn in large amount was occurred by rapid cooling, where plate liked Ag3Sn was formed by slow cooling condition. Extremely slow cooling such as furnace cooling results large plate-like or pillar-like Ag3Sn to form, particularly in solder matrix adjacent to the solder/Cu interface. The enrichment of Sn in Cu 6Sn5 IMC layer formation at interface causes Sn depletion at the adjacent area near the interface. As a result, Ag atoms were enriched relatively which favored formation and growth of primary Ag3Sn in liquid phase.",

author = "Lee, {Hwa Teng} and Chen, {Yin Fa} and Hong, {Ting Fu} and Shih, {Ku Ta}",

year = "2009",

doi = "10.1109/EPTC.2009.5416420",

language = "English",

isbn = "9781424451005",

series = "Proceedings of the Electronic Packaging Technology Conference, EPTC",

pages = "875--878",

booktitle = "EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference",

note = "2009 11th Electronic Packaging Technology Conference, EPTC 2009 ; Conference date: 09-12-2009 Through 11-12-2009",

}

Lee, HT, Chen, YF, Hong, TF & Shih, KT 2009, Effect of cooling rate on Ag₃Sn formation in Sn-Ag based lead-free solder. in EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference., 5416420, Proceedings of the Electronic Packaging Technology Conference, EPTC, pp. 875-878, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, Singapore, 09-12-09. https://doi.org/10.1109/EPTC.2009.5416420

Effect of cooling rate on Ag₃Sn formation in Sn-Ag based lead-free solder. / Lee, Hwa Teng; Chen, Yin Fa; Hong, Ting Fu et al.
EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. 2009. p. 875-878 5416420 (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder

AU - Lee, Hwa Teng

AU - Chen, Yin Fa

AU - Hong, Ting Fu

AU - Shih, Ku Ta

PY - 2009

Y1 - 2009

N2 - Effect of solidification cooling rate on Ag3Sn formation and its morphological appearance in Sn-Ag based lead-free solder was investigated. Depends on cooling rate, three types of Ag3Sn compound with different morphologies may form by solidification. They are particle-like, needle-like, and platelike respectively. Small particle-like Ag3Sn in large amount was occurred by rapid cooling, where plate liked Ag3Sn was formed by slow cooling condition. Extremely slow cooling such as furnace cooling results large plate-like or pillar-like Ag3Sn to form, particularly in solder matrix adjacent to the solder/Cu interface. The enrichment of Sn in Cu 6Sn5 IMC layer formation at interface causes Sn depletion at the adjacent area near the interface. As a result, Ag atoms were enriched relatively which favored formation and growth of primary Ag3Sn in liquid phase.

AB - Effect of solidification cooling rate on Ag3Sn formation and its morphological appearance in Sn-Ag based lead-free solder was investigated. Depends on cooling rate, three types of Ag3Sn compound with different morphologies may form by solidification. They are particle-like, needle-like, and platelike respectively. Small particle-like Ag3Sn in large amount was occurred by rapid cooling, where plate liked Ag3Sn was formed by slow cooling condition. Extremely slow cooling such as furnace cooling results large plate-like or pillar-like Ag3Sn to form, particularly in solder matrix adjacent to the solder/Cu interface. The enrichment of Sn in Cu 6Sn5 IMC layer formation at interface causes Sn depletion at the adjacent area near the interface. As a result, Ag atoms were enriched relatively which favored formation and growth of primary Ag3Sn in liquid phase.

UR - http://www.scopus.com/inward/record.url?scp=77950928198&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77950928198&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2009.5416420

DO - 10.1109/EPTC.2009.5416420

M3 - Conference contribution

AN - SCOPUS:77950928198

SN - 9781424451005

T3 - Proceedings of the Electronic Packaging Technology Conference, EPTC

SP - 875

EP - 878

BT - EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference

T2 - 2009 11th Electronic Packaging Technology Conference, EPTC 2009

Y2 - 9 December 2009 through 11 December 2009

ER -