Effect of cooling rate on Ag3Sn formation in Sn-Ag based lead-free solder

Hwa Teng Lee, Yin Fa Chen, Ting Fu Hong, Ku Ta Shih

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Effect of solidification cooling rate on Ag3Sn formation and its morphological appearance in Sn-Ag based lead-free solder was investigated. Depends on cooling rate, three types of Ag3Sn compound with different morphologies may form by solidification. They are particle-like, needle-like, and platelike respectively. Small particle-like Ag3Sn in large amount was occurred by rapid cooling, where plate liked Ag3Sn was formed by slow cooling condition. Extremely slow cooling such as furnace cooling results large plate-like or pillar-like Ag3Sn to form, particularly in solder matrix adjacent to the solder/Cu interface. The enrichment of Sn in Cu 6Sn5 IMC layer formation at interface causes Sn depletion at the adjacent area near the interface. As a result, Ag atoms were enriched relatively which favored formation and growth of primary Ag3Sn in liquid phase.

Original languageEnglish
Title of host publicationEPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages875-878
Number of pages4
DOIs
Publication statusPublished - 2009 Dec 1
Event2009 11th Electronic Packaging Technology Conference, EPTC 2009 - Singapore, Singapore
Duration: 2009 Dec 92009 Dec 11

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2009 11th Electronic Packaging Technology Conference, EPTC 2009
CountrySingapore
CitySingapore
Period09-12-0909-12-11

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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