Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder

Chin Wei Liu, Kwang Lung Lin

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

In this study the effect of Cr content (0.02 wt.% to 0.2 wt.%) on the wetting interaction between high-temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-free solders and Cu has been investigated using the wetting balance method. Differential scanning calorimetry (DSC) investigation showed that Cr addition reduces the liquidus temperature slightly while raising the solidus temperature. Flux-assisted wetting experiments were carried out at an immersion rate of 15 mm/s at 435°C. The results show that the shortest wetting time of around 0.7 s was achieved when 0.1 wt.% Cr was added, but the wetting force tends to decrease with the Cr content. Cr addition enhances the formation of interfacial Cu5Zn8 intermetallic compound (IMC) during air cooling, but the opposite effect was observed for water cooling. The results suggest that Cr addition depresses the formation of the Cu5Zn8 layer in liquid/solid reaction, but enhances the formation of the Cu5Zn8 layer in solid/solid reaction.

Original languageEnglish
Pages (from-to)4502-4509
Number of pages8
JournalJournal of Electronic Materials
Volume43
Issue number12
DOIs
Publication statusPublished - 2014 Dec

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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