Effect of crystallinity and preferred orientation of Ta₂N films on diffusion barrier properties for copper metallization

Engineering & Materials Science

• Diffusion barriers 100%
• Crystallinity 82%
• Metallizing 78%
• Copper 55%
• Silicon 53%
• Substrates 47%
• Tantalum 46%
• Nitrides 40%
• Crystalline materials 35%
• Thermodynamic stability 35%
• Annealing 33%
• X ray diffraction 33%
• Thin films 32%
• Temperature 27%

Chemical Compounds

• Diffusion Barrier 85%
• Nitride 65%
• Annealing 53%
• Crystallinity 51%
• Amorphous Material 46%
• Thermal Stability 44%
• Diffusion 41%
• X-Ray Diffraction 33%
• Liquid Film 32%

Physics & Astronomy

• crystallinity 60%
• tantalum nitrides 51%
• copper 48%
• structural stability 39%
• viability 36%
• silicon 36%
• thermal stability 29%
• probes 20%
• annealing 20%
• temperature 20%
• characterization 18%
• diffraction 18%
• thin films 17%
• x rays 15%