Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder

Kwang Lung Lin, Jia Wei Hwang

Research output: Contribution to journalArticlepeer-review

5 Citations (Scopus)

Abstract

The crystallinity of electroless nickel deposit was manipulated by applying bath stabilizer including lead acetate and thiourea. A crystalline deposit and a higher deposition rate of the electroless nickel were achieved with thiourea than with lead acetate. The effect of crystallinity on the diffusion barrier performance of the electroless nickel deposit was performed between solder and Cu deposit. The thickness of the electroless nickel deposit investigated includes 1, 3, and 5 μm. It was found that both crystalline and amorphous deposit performs similarly in barrier performance except when the thickness of the deposit is as thin as 1 μm. The cross sectional elemental analysis results indicate that a thickness of 3 μm of electroless can withstand ten times of reflow without counter diffusion between Sn and Cu, although Ni-Sn intermetallic compounds were formed. The 3 μm thickness is also adequate for barrier function after 1000 hours of aging at 150 °C.

Original languageEnglish
Pages (from-to)509-513
Number of pages5
JournalIEEE Transactions on Advanced Packaging
Volume25
Issue number4
DOIs
Publication statusPublished - 2002 Nov

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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