Effect of current density and plating time on the morphology of copper electrodeposits on an AFM tip

K. L. Lin, S. Y. Chen, U. S. Mohanty

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

An attempt was made to electrodeposit copper on a nanosize atomic force microscopy (AFM) tip by varying the magnitude of current densities with plating time and vice versa. Changes in the current density and plating time resulted in significant changes in the morphology of copper deposits on the AFM probe containing the tip. Scanning electron microscopy (SEM) results revealed that a nonuniform layer of copper was formed on the open areas surrounding the tip; however, no copper deposition was observed on the AFM tip in the absence of photoresist poly(methyl methacrylate) (PMMA). The electron-beam lithography technique proved to be a versatile tool for the electrodeposition of copper on the AFM tip in the presence of photoresist PMMA. Copper was electrochemically deposited on the e-beam modified regions of the AFM probe at a current density of 0.6 A/ dm2 with plating times ranging from 300 to 2400 s.

Original languageEnglish
Pages (from-to)D251-D255
JournalJournal of the Electrochemical Society
Volume155
Issue number4
DOIs
Publication statusPublished - 2008 Mar 14

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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