TY - JOUR
T1 - Effect of gate voltage on hot-carrier-induced on-resistance degradation in high-voltage n-type lateral diffused metal-oxide-semiconductor transistors
AU - Chen, Shiang Yu
AU - Chen, Jone-Fang
AU - Wu, Kuo Ming
AU - Lee, J. R.
AU - Liu, C. M.
AU - Hsu, S. L.
PY - 2008/4/25
Y1 - 2008/4/25
N2 - The phenomenon and mechanism of hot-carrier-induced on-resistance (R on) degradation for the n-type lateral diffused metal-oxide- semiconductor (MOS) transistors stressed under various gate voltages (V g) are investigated. Ron degradation of the device is found to be attributed to the interface state (Nit) generation in the N- drift region. Moreover, Aon degradation is almost identical for the devices stressed under medium Vg and high V g, despite the fact that bulk current of the device is much greater at high Vg bias. Such an anomalous Ron degradation is suggested to be the result of two combined factors: the magnitude of impact ionization rate and Nit generation efficiency.
AB - The phenomenon and mechanism of hot-carrier-induced on-resistance (R on) degradation for the n-type lateral diffused metal-oxide- semiconductor (MOS) transistors stressed under various gate voltages (V g) are investigated. Ron degradation of the device is found to be attributed to the interface state (Nit) generation in the N- drift region. Moreover, Aon degradation is almost identical for the devices stressed under medium Vg and high V g, despite the fact that bulk current of the device is much greater at high Vg bias. Such an anomalous Ron degradation is suggested to be the result of two combined factors: the magnitude of impact ionization rate and Nit generation efficiency.
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U2 - 10.1143/JJAP.47.2645
DO - 10.1143/JJAP.47.2645
M3 - Article
AN - SCOPUS:54249168441
SN - 0021-4922
VL - 47
SP - 2645
EP - 2649
JO - Japanese Journal of Applied Physics
JF - Japanese Journal of Applied Physics
IS - 4 PART 2
ER -