Effect of in addition on Sn-Ag-Sb lead-free solder system

Hwa Teng Lee, Fok Foo Lee, Ting Fu Hong, Hsiao Wei Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The present study investigates the effect of 1-5wt.% Indium additions on microstructure, properties and interfacial IMC's formation of Sn-3Ag-2Sb(SAS) lead-free solder alloys. Experimental results show that addition of indium results in formation of intermetallic compounds of Ag-Sn-In phase and InSb phase. Sn atoms in Ag Sn compound formed originally in Sn-Ag solder system are replaced by In atoms in SAS-xln solder system as indium content is increased. A structural and morphological transformation ofAg 3n), Ag 2 (Sn,ln) and finally to Ag 2 (In,Sn) is confirmed. Meanwhile, transformation of interfacial Cu 6Sn 5 IMC layer to CU 6 (Sn,ln)s is progressed as the level of In content is increased and accelerated by thermal storage as well.

Original languageEnglish
Title of host publication2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
Pages191-194
Number of pages4
DOIs
Publication statusPublished - 2008 Dec 1
Event2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 - Taipei, Taiwan
Duration: 2008 Oct 222008 Oct 24

Publication series

Name2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Other

Other2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
CountryTaiwan
CityTaipei
Period08-10-2208-10-24

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Mechanical Engineering

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