Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints

Hwa-Teng Lee, Yin Fa Chen, Alexander Schwedt, Joachim Mayer

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

This study investigates the effects of trace amounts of La addition on the microstructure, adhesive strength and fracture behavior of Sn-3.5Ag solder joints. The electron backscatter diffraction (EBSD) results confirmed that the face-centered cubic (fcc) structure of LaSn 3 compounds distributed randomly in the β-Sn matrix had no obvious preferred orientation. La additions reduced the ripening reaction rate of the scallop-type Cu 6 Sn 5 compounds at the interface layer. In spite of the significant refinement of microstructure and suppression of the growth of intermetallic Cu 6 Sn 5 compounds caused by the La additions, the expected enhancement of adhesive strength and ductility did not occur apparently. With the aid of Argon Beam Milling, we have found defects and voids inside the LaSn 3 compounds; these features were closely related to the crack initiation and formation during the adhesive tensile test. Consequently, the beneficial effect due to the refinement of microstructure and suppression of interfacial layer compounds was retarded. In the aged samples, trace amounts of La addition suppressed the Sn diffusion and retarded the growth of the Cu 6 Sn 5 layer, but not that of the Cu 3 Sn layer.

Original languageEnglish
Pages (from-to)3630-3638
Number of pages9
JournalMaterials Science and Engineering A
Volume528
Issue number10-11
DOIs
Publication statusPublished - 2011 Apr 25

Fingerprint

solders
Soldering alloys
adhesives
Adhesives
Crack initiation
Microstructure
crack initiation
microstructure
Argon
retarding
Electron diffraction
Reaction rates
Intermetallics
Ductility
tensile tests
ductility
intermetallics
voids
Defects
reaction kinetics

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Lee, Hwa-Teng ; Chen, Yin Fa ; Schwedt, Alexander ; Mayer, Joachim. / Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints. In: Materials Science and Engineering A. 2011 ; Vol. 528, No. 10-11. pp. 3630-3638.
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Effect of La addition on adhesive strength and fracture behavior of Sn-3.5Ag solder joints. / Lee, Hwa-Teng; Chen, Yin Fa; Schwedt, Alexander; Mayer, Joachim.

In: Materials Science and Engineering A, Vol. 528, No. 10-11, 25.04.2011, p. 3630-3638.

Research output: Contribution to journalArticle

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